Design and Fabrication of Monolithic Multidimensional Data Registration CMOS/MEMS Ink-Jet Printhead

Liou, Jian-Chiun; Tseng, Fan‐Gang; Huang, Chun-Chieh

doi:10.1109/jmems.2010.2055548

Cited by 3 publications

(1 citation statement)

References 27 publications

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“…In the past decades, some research on the preparation technology of inkjet printhead chambers has been reported. Liou et al (2010) fabricated a monolithic thermal inkjet printhead based on MEMS fabrication processes including the sacrificial layer process, and the results showed that the major advantage of the inkjet chip assembly processes is improved throughput [ 22 ]. Wang et al (2019) fabricated chambers of inkjet printheads by thermal bonding an SU-8 nozzle plate with a suitable crosslinked degree; the results showed that the optimized bonding strength of 0.57 MPa and chamber deformation rate of 4.35% were obtained in the final inkjet printhead [ 17 ].…”

Section: Introductionmentioning

confidence: 99%

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

Huang

Tang²,

Liu

et al. 2022

Micromachines

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The process of fabricating chambers is becoming more important for inkjet printheads. However, there are some problems with the majority of present fabrication methods, such as nozzle structural deformation, blocked chambers, and collapsed chambers. In this paper, we propose a new process for preparing printhead chips by bonding tantalum nitride thin-film heaters and SU-8 chamber film using UV curing optical adhesive. This process simplifies the preparation process of printhead chips and overcomes the limitations of the traditional adhesive bonding process. Firstly, a chamber film was prepared by the molding lithography process based on a PDMS mold. The chamber film was then bonded with the membrane heater by the adhesive bonding process based on film transfer to form a thermal bubble printhead chip. Finally, the chip was integrated with other components to form a thermal inkjet printhead. The results show that the overflow width of bonding interface of 3.10 μm and bonding strength of 3.3 MPa were achieved. In addition, the printhead could stably eject polyvinyl pyrrolidone binder droplets, which are expected to be used for binder-jetting printing of powder such as ceramics, metals, and sand molds. These results might provide new clues to better understand the adhesive bonding process based on film transfer and the new applications of inkjet printheads.

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Section: Introductionmentioning

confidence: 99%

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

Huang

Tang²,

Liu

et al. 2022

Micromachines

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Analysis of DoD inkjet printhead performance for printable electronics fabrication using dynamic lumped element modeling and swarm intelligence based optimal prediction

Sun

et al. 2015

J. Cent. South Univ.

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The major challenge in printable electronics fabrication is to effectively and accurately control a drop-on-demand (DoD) inkjet printhead for high printing quality. In this work, an optimal prediction model, constructed with the lumped element modeling (LEM) and the artificial bee colony (ABC) algorithm, was proposed to efficiently predict the combination of waveform parameters for obtaining the desired droplet properties. For acquiring higher simulation accuracy, a modified dynamic lumped element model (DLEM) was proposed with time-varying equivalent circuits, which can characterize the nonlinear behaviors of piezoelectric printhead. The proposed method was then applied to investigate the influences of various waveform parameters on droplet volume and velocity of nano-silver ink, and to predict the printing quality using nano-silver ink. Experimental results show that, compared with two-dimension manual search, the proposed optimal prediction model perform efficiently and accurately in searching the appropriate combination of waveform parameters for printable electronics fabrication.

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Intelligent Adjustment of Printhead Driving Waveform Parameters for 3D Electronic Printing

Lin¹,

Jing

Chen

et al. 2017

MATEC Web Conf.

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Abstract. In practical applications of 3D electronic printing, a major challenge is to adjust the printhead for a high print resolution and accuracy. However, an exhausting manual selective process inevitably wastes a lot of time. Therefore, in this paper, we proposed a new intelligent adjustment method, which adopts artificial bee colony algorithm to optimize the printhead driving waveform parameters for getting the desired printhead state. Experimental results show that this method can quickly and accuracy find out the suitable combination of driving waveform parameters to meet the needs of applications.

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Design and Fabrication of Monolithic Multidimensional Data Registration CMOS/MEMS Ink-Jet Printhead

Cited by 3 publications

References 27 publications

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

Analysis of DoD inkjet printhead performance for printable electronics fabrication using dynamic lumped element modeling and swarm intelligence based optimal prediction

Intelligent Adjustment of Printhead Driving Waveform Parameters for 3D Electronic Printing

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