Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development

Abstract

Printing electronic passive components suffer from the lack of a wide variety of appropriate materials for developing components with specific characteristics, for specific dimensions. This paper introduces a multilayer approach for the inkjet printing of resistors, inductors and capacitors, showing that it is possible to manufacture tailored passive circuit elements and therefore their implementation into functional printed electronics. The materials and process steps for the manufacturing, the individual component characteristics and the equivalent circuit is provided for all passive devices.

Current and Potential Applications of Additive Manufacturing for Power Electronics

“…Correia et al [33] attempted to gauge the feasibility of tailored passive components (inductors, resistors, capacitors), implementing inkjet printing and comparing the results to the theoretical equivalent RLC circuit. Correia et al [33] determined that the capacitor and resistor both successfully resulted in nearly identical capacitance and resistance to the ideal equivalent circuit values. However, poor dimensional tolerancing of the planar inductor's coils (coil line width and spacing) resulted in non-uniformities that negatively impacted the inductor's electrical properties.…”

Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices

“…[11,12,17,18] Although, the printing of these novel materials has always been a big challenge, but due to the continuously evolving market scenario, it has recently become possible to deposit and postprocess (curing/sintering) these materials with high reliability, thereby, satisfying the electrical demands of devices and circuits, e.g., passive device circuit, filter circuit, and photodetectors. [14,19,20] This has resulted in the quest for the inkjet technology to get engaged into several other sophisticated and challenging fields like medical implantation and prosthetics. [21][22][23][24] The field of medical implantation is vast, out of which some of them do not really require printed devices to remain in the body for an extended time duration.…”

“…[ 8–11 ] Several kinds of flexible electronics have already been manufactured using the inkjet printing technology, e.g., capacitors, thin‐film transistors (TFTs), resistors, sensors and detectors, radio frequency antennas, photovoltaics, and so on. [ 4,5,7,9–16 ] All these printed applications are clear evidences to validate the implementation of inkjet technology to deposit fundamental layers with electronic properties, i.e., conductors using nanoparticle or particle‐free‐based metallic or polymeric inks, dielectrics by polymer‐based or hybrid inks with embedded nanoparticles and organic semiconductors (SCs). [ 11,12,17,18 ] Although, the printing of these novel materials has always been a big challenge, but due to the continuously evolving market scenario, it has recently become possible to deposit and postprocess (curing/sintering) these materials with high reliability, thereby, satisfying the electrical demands of devices and circuits, e.g., passive device circuit, filter circuit, and photodetectors.…”

Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

“…Even though printed electronics technologies bear huge potential for various applications, it is neither feasible nor reasonable to replace all components of an entire silicon-based electronic system with printed parts. As for today, many fully printed electrical devices, such as thin film transistors [17], inductors [18], capacitors [19], memory [20] and batteries [21], cannot yet keep up with conventional silicon components regarding performance and yield. Furthermore, the fully additive manufacturing of complete microcontrollers providing data read outs, analysis and transmission will neither be feasible nor reasonable in the foreseeable future.…”