Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

Rauter, Lukas; Zikulnig, Johanna; Sinani, Taulant; Zangl, Hubert; Faller, Lisa-Marie

doi:10.3390/electronicmat1010002

Cited by 14 publications

(12 citation statements)

References 61 publications

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“…[ 224 ] Other than that, the flexibility of using a variety of substrates for printed electronics also poses a challenge for electrical bonding such as soldering, adhesive bonding, and crimping because they have different requirements such as process temperature, the desired flexibility, the conductivity, and the adhesive strength. [ 225 ] From the viewpoint of mass production of electronics, the throughput of MLMM electronics still pales in comparison to the conventional manufacturing techniques. [ 210 ]…”

Section: Potential and Challenges Of 3d Printed Mlmm Electronicsmentioning

confidence: 99%

3D Printing of Multilayered and Multimaterial Electronics: A Review

Goh

Zhang

Chong

et al. 2021

Adv Elect Materials

181

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3D printing, also known as additive manufacturing, is a manufacturing process in which the materials are deposited layer by layer in an additive manner. With the advancement in materials and manufacturing technology, 3D printing has found its applications in the field of electronics manufacturing. Initially, 3D printing is used for the fabrication of electronic components with single material designs such as resistors, inductors, circuits, antennas, strain gauges, etc. Recently, there are many works involving the use of 3D printing fabrication techniques for advanced electronic components and devices such as parallel plate capacitors, inductors, organic light‐emitting diodes, photovoltaics, transistors, displays, etc. which involve multilayer multimaterial printing. Despite these many works, there has been no review on the design and fabrication consideration for the 3D printing of multilayered and multimaterial (MLMM) electronics. As such, this review aims to summarize the current landscape of 3D printing of MLMM electronics and provide some insights on the design consideration, fabrication strategies, and challenges of 3D printing of MLMM electronics. In particular, the focus will be placed on discussing the interface conditions between different materials such as surface wettability, surface roughness, material compatibility, and the considerations for postprocessing treatments.

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Section: Potential and Challenges Of 3d Printed Mlmm Electronicsmentioning

confidence: 99%

3D Printing of Multilayered and Multimaterial Electronics: A Review

Goh

Zhang

Chong

et al. 2021

Adv Elect Materials

181

View full text Add to dashboard Cite

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“…To attach the ultra-thin chips and other rigid elements, the available methods are soldering, conductive adhesives, or printable inks [60]. Generally, the use of solder (tin-lead) for flexible electronics is restricted since it demands high temperatures (>250 • C) [63,64]. As a result, some solder alternatives that present lower reflow temperatures (<175 • C) based on indium, bismuth, and silver have emerged [65].…”

Section: Fhementioning

confidence: 99%

The role of printed electronics and related technologies in the development of smart connected products

Buga¹,

Viana²

2022

Flex. Print. Electron.

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The emergence of novel materials with flexible and stretchable characteristics, and the use of new processing technologies, have allowed for the development of new connected devices and applications. Using printed electronics, traditional electronic elements are being combined with flexible components and allowing for the development of new smart connected products. As a result, devices that are capable of sensing, actuating, and communicating remotely while being low-cost, lightweight, conformable, and easily customizable are already being developed. Combined with the expansion of the Internet of Things, artificial intelligence, and encryption algorithms, the overall attractiveness of these technologies has prompted new applications to appear in almost every sector. The exponential technological development is currently allowing for the “smartification” of cities, manufacturing, healthcare, agriculture, logistics, among others. In this review article, the steps towards this transition are approached, starting from the conceptualization of smart connected products and their main markets. The manufacturing technologies are then presented, with focus on printing-based ones, compatible with organic materials. Finally, each one of the printable components is presented and some applications are discussed.

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“…Typically, most flexible printed electronic applications are based on organic or polymer inks, due to their characteristics such as conductivity, electrical and mechanical stability, and compatibility with a variety of substrates [ 23 , 24 ], while maintaining biocompatibility [ 25 , 26 , 27 ]. Nevertheless, it is important to measure and accurately define the optimal conditions for printing conductive lines using inkjet; there have been various efforts towards accurately measuring the resistivity of inkjet-printed structures [ 28 , 29 ], mainly because they are used for interconnections [ 30 , 31 ], electrode fabrication [ 32 ], etc. The replicability of printed structures is vital for actually defining the large-scale production capabilities of the material technology stack, with failures affecting device integrity [ 33 ], performance [ 34 , 35 ], and accurate fabrication [ 36 ].…”

Section: Introductionmentioning

confidence: 99%

Study of Single and Multipass f–rGO Inkjet-Printed Structures with Various Concentrations: Electrical and Thermal Evaluation

Apostolakis

Barmpakos

Pilatis

et al. 2023

Sensors

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Reduced graphene oxide (rGO) is a derivative of graphene, which has been widely used as the conductive pigment of many water-based inks and is recognized as one of the most promising graphene-based materials for large-scale and low-cost production processes. In this work, we evaluate a custom functionalised reduced graphene oxide ink (f–rGO) via inkjet-printing technology. Test line structures were designed and fabricated by the inkjet printing process using the f–rGO ink on a pretreated polyimide substrate. For the electrical characterisation of these devices, two-point (2P) and four-point (4P) probe measurements were implemented. The results showed a major effect of the number of printed passes on the resulting resistance for all ink concentrations in both 2P and 4P cases. Interesting results can be extracted by comparing the obtained multipass resistance values that results to similar effective concentration with less passes. These measurements can provide the ground to grasp the variation in resistance values due to the different ink concentrations, and printing passes and can provide a useful guide in achieving specific resistance values with adequate precision. Accompanying topography measurements have been conducted with white-light interferometry. Furthermore, thermal characterisation was carried out to evaluate the operation of the devices as temperature sensors and heaters. It has been found that ink concentration and printing passes directly influence the performance of both the temperature sensors and heaters.

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Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

Cited by 14 publications

References 61 publications

3D Printing of Multilayered and Multimaterial Electronics: A Review

3D Printing of Multilayered and Multimaterial Electronics: A Review

The role of printed electronics and related technologies in the development of smart connected products

Study of Single and Multipass f–rGO Inkjet-Printed Structures with Various Concentrations: Electrical and Thermal Evaluation

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