Design and manufacture of structured surfaces by electroforming

Castellano, Pedro Manuel Hernández; Benítez, Antonio N.; Díaz-Padilla, N.; Ortega-García, F.; Socorro-Perdomo, P.; Marrero-Alemán, María Dolores; Salguero, Jorge

doi:10.1016/j.promfg.2017.09.030

Cited by 14 publications

(7 citation statements)

References 14 publications

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“…It uses special systems such as sources of pulsating energy with polarity inversion [32] or magnetic or ultrasonic electrolytic bath agitation systems [33]. The Integrated and Advanced Manufacturing research Group of the University of Las Palmas de Gran Canaria (ULPGC) has extensive previous experience in the use of special parameters and conditions for electroforming [34,35].…”

Section: Introductionmentioning

confidence: 99%

Combined Manufacturing Process of Copper Electrodes for Micro Texturing Applications (AMSME)

et al. 2021

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Surface texturing has brought significant improvements in the functional properties of parts and components. Sinker electro discharge machining (SEDM) is one of the processes which generates great texturing results at different scale. An electrode is needed to reproduce the geometry to be textured. Some geometries are difficult or impossible to achieve on an electrode using conventional and even unconventional machining methods. This work sets out the advances made in the manufacturing of copper electrodes for electro erosion by additive manufacturing, and their subsequent application to the functional texturing of Al-Cu UNS A92024-T3 alloy. A combined procedure of digital light processing (DLP) additive manufacturing, sputtering and micro-electroforming (AMSME), has been used to produce electrodes. Also, a specific laboratory equipment has been developed to reproduce details on a microscopic scale. Shells with outgoing spherical geometries pattern have been manufactured. AMSME process has shown ability to copper electrodes manufacturing. A highly detailed surface on a micrometric scale have been achieved. Copper shells with minimum thickness close to 300 µm have been tested in sinker electro discharge machining (SEDM) and have been shown very good performance in surface finishing operations. The method has shown great potential for use in surfaces texturing.

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Section: Introductionmentioning

confidence: 99%

Combined Manufacturing Process of Copper Electrodes for Micro Texturing Applications (AMSME)

et al. 2021

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“…In the electroforming process, the method of deposited layer formation is important as it is used to prepare metal parts with special shapes or molds with high-precision requirements [1][2][3]. The electroforming process relies on the electrons from metal ions stacked on the cathode surface one by one, and its theoretical accuracy can reach the ion level.…”

Section: Introductionmentioning

confidence: 99%

Optimization of Copper Electroforming Process Parameters Based on Double Hidden Layer BP Neural Network

Chen

Zhao

et al. 2021

Micromachines

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In order to optimize the pulse electroforming copper process, a double hidden layer BP (back propagation) neural network was constructed. Through sample training, the mapping relationship between electroforming copper process conditions and target properties was accurately established, and the prediction of microhardness and tensile strength of the electroforming layer in the pulse electroforming copper process was realized. The predicted results were verified by electrodeposition copper test in copper pyrophosphate solution system with pulse power supply. The results show that the microhardness and tensile strength of copper layer predicted by “3-4-3-2” structure double hidden layer neural network are very close to the experimental values, and the relative error is less than 2.82%. In the parameter range, the microhardness of copper layer is between 100.3~205.6 MPa and the tensile strength is between 165~485 MPa. When the microhardness and tensile strength are optimal, the corresponding range of optimal parameters are as follows: current density is 2–3 A·dm−2, pulse frequency is 1.5–2 kHz and pulse duty cycle is 10–20%.

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“…This process becomes very interesting due to the wide range of applications such as manufacturing of grid parts (plates, printing cylinders and so on), the radar waveguides and micro components used in medical, the optical or mechanical applications, and being useful tools for other manufacturing processes . Up to now, electroforming process has proven to be capable of reproducing the smallest and the most accurate details for a surface, strict control over the physical or mechanical features of the electroformed‐part through selecting the electrolytic bath composition and process parameters …”

Section: Introductionmentioning

confidence: 99%

“…[1] Up to now, electroforming process has proven to be capable of reproducing the smallest and the most accurate details for a surface, strict control over the physical or mechanical features of the electroformed-part through selecting the electrolytic bath composition and process parameters. [2] Electroforming technology has developed on the basis of the electroplating process. The anode, electrolyte, workpiece model for plating and power supply are the basics of the mentioned process.…”

Section: Introductionmentioning

confidence: 99%

Numerical and Experimental Analysis of Copper Electroforming on an Aluminum Substrate as a Rotating Cone Electrode Cell

et al. 2019

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In this paper, the advantages of numerical simulation to improve the process of copper electroforming are demonstrated. In this regard, the finite element model of copper electroforming for a rotating cone electrode was first prepared and then, the effect of the key parameters, such as applied current density, solution conductivity, electrode spacing, and anode height, on the uniformity of the thickness was investigated. The model combines tertiary current distribution with Bulter–Volmer electrode kinetics and computational fluid dynamics at the turbulent condition. In order to validate the model, a cone‐shaped shell was produced by electroforming method in the laboratory. The obtained results illustrate that the tertiary current distribution model on the rotating cone cell cathode is accurate and efficient for the electroforming process simulation and it can be used for parametric studies. Moreover, the effect of the current density on the morphology and properties of the electroformed layer was investigated.

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Design and manufacture of structured surfaces by electroforming

Cited by 14 publications

References 14 publications

Combined Manufacturing Process of Copper Electrodes for Micro Texturing Applications (AMSME)

Combined Manufacturing Process of Copper Electrodes for Micro Texturing Applications (AMSME)

Optimization of Copper Electroforming Process Parameters Based on Double Hidden Layer BP Neural Network

Numerical and Experimental Analysis of Copper Electroforming on an Aluminum Substrate as a Rotating Cone Electrode Cell

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