Design and Process Optimization for Dual Row QFN

Retuta, D.; Lim, Byeong-Ok; Tan, Haoshu

doi:10.1109/ectc.2006.1645908

Cited by 15 publications

(8 citation statements)

References 3 publications

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“…The stresses and plastic strain accumulating as the temperature cycling going, and the crack potentially induced near the maximum stress place. Ultimately, the delamination is resulted along with the propagating of crack, which is according with Retuta's experimental results [5]. The curve of the solder joints stress at the maximum stress point changing with time is shown in Figure 4, from which it can observed that the stress of solder joints show a periodic changes with temperature changes, and the maximum stress of solder joints is gradually increasing with the increase of the number of temperature cycles.…”

Section: Fem Modelingmentioning

confidence: 80%

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Thermal fatigue life optimization of QFN package based on Taguchi Method

Wei

Qin

Gao

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Quad Flat non-lead(QFN) packages known with many outstanding properties. However the thermal stresses and plastic strain accumulation in solder joints during temperature and power cycling can be induced due to the significant mismatch in the coefficients of thermal expansion (CTE) of dissimilar materials. The damage caused by these stresses and plastic strain accumulation, which are induced during accelerated temperature cycling due to the CTE mismatch between the various materials that encompass the QFN package, ultimately cause the failures of solder joints. In this paper the ANSYS software is adopted to build a quarter of model about QFN, which is sUbjected to the thermal recycling of -40� 125°C. The thermal fatigue life of QFN is calculated based on the maximum strain range and the Coffin-Manson equation. Anand's viscoplastic material model is used to describe the constitutive equation of the solder joints in this study. A L27(3 8 ) orthogonal array is built based on Taguchi Method to figure out the optimized conditions. Besides, in order to avoid accidental error, ANOV A is carried out to estimate the error and find the most important factors. The results indicate that only five material and structural factors are the most important ones, and the other factors are selected by price or convenience. Finally, the fatigue life after optimal design by Taguchi method has 3.43 folds on the fatigue life over the original design.

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Section: Fem Modelingmentioning

confidence: 80%

“…The failure of solder joints is the main failure mechanism for electronic products during the service process, and may result in the failure of the entire package. So the reliability of solder joints has been focused on over the past years [5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Thermal fatigue life optimization of QFN package based on Taguchi Method

Wei

Qin

Gao

et al. 2012

2012 13th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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“…However, thermal fatigue reliability during the temperature cycling has not been well analyzed. Retuta et al [3] studied the effects of structural designs including solder joint shape, die size and thickness as well as material properties on the fatigue life of dual-row QFN package under temperature cycling by 3D slice finite element modeling. England et al [4] applied both experiments and finite element method to estimate the fatigue life of dual row QFN under temperature cycling, and found that dual row design can actually improve solder joint reliability performance when compared to a single row design of similar body size.…”

Section: Introductionmentioning

confidence: 99%

Finite element based DOE methodology for thermal fatigue reliability design of multi-row QFN packages

Xia

Qin

Gao

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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A DOE (Design of Experiment) methodology based on finite element analysis is presented to investigate thermal fatigue reliability of multi-row QFN packages. In this method, the influences of material properties, structural geometries and temperature cycling profiles on thermal fatigue reliability are evaluated, a L27(3 8 ) orthogonal array is built based on Taguchi method to figure out optimized factor combination design for promoting thermal fatigue reliability. Anand constitutive model is adopted to describe the viscoplastic behavior of lead-free solder Sn3.0Ag0.5Cu. The stress and strain in solder joints under temperature cycling are studied by 3D finite element model. The modified Coffin-Manson model is employed to predict the fatigue life of solder joints. Results indicate that CTE of PCB board, the height of solder joint and CTE of epoxy molding compound have critical influence on thermal fatigue life of solder joints. The fatigue life of multi-row QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after optimized factor combination design.

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“…In order to expand the application range of leadless packages and preserving cost and performance advantages, the efforts have been devoted to increasing the number of their lead counts, following the QFN structure in particular (e.g., [2,3]). However, the multiple-row QFN does suffer from solder bridging between neighboring terminals when the pitch is small.…”

Section: Introductionmentioning

confidence: 99%

Advanced QFN Surface Mount Application Notes development

Tseng¹,

Lin

et al. 2010

2010 12th Electronics Packaging Technology Conference

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The advanced Quad Flat No-Lead (aQFN) package is an enhanced version of conventional QFN with multiple row terminals of featuring higher number of I/O ports. The aQFN thermal and electrical performance are superior due to smaller profile and shorter interconnects and the solder wettability control and board-level thermo-mechanical reliability are greatly enhanced over conventional QFN because of the higher package standoff. aQFN provides similar I/O number approaching that of a BGA-type chip-scale package (FBGA) but much less cost since the expensive substrate is replaced by lead frame. aQFN turns out to be an ideal low cost solution for electrical components of portable telecommunication applications such as IrDA, blue-tooth, RFID, cell phone baseband etc. for its superior thermal, electrical, reliability performances and miniaturized package size, With such advantages, the replacement of FBGA with aQFN in low up to medium lead-count applications is therefore highly expectable, especially for handheld & PDA devices with its related applications. With such higher pin-count, multi-row and small terminal pitch than QFN, how to design the aQFN package terminals for printed circuit board layout and the stencil patterning and opening for solder paste printing become crucial issues. aQFN will be introduced in terms of its application advantages, development, fabrication process flow, SMT process with stencil design guideline for surface mount assembly yield. Finally, "Surface Mount Application Notes" have been issued.

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Design and Process Optimization for Dual Row QFN

Cited by 15 publications

References 3 publications

Thermal fatigue life optimization of QFN package based on Taguchi Method

Thermal fatigue life optimization of QFN package based on Taguchi Method

Finite element based DOE methodology for thermal fatigue reliability design of multi-row QFN packages

Advanced QFN Surface Mount Application Notes development

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