2009 14th IEEE European Test Symposium 2009
DOI: 10.1109/ets.2009.23
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Design and Test Challenges in Resistive Switching RAM (ReRAM): An Electrical Model for Defect Injections

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Cited by 23 publications
(12 citation statements)
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“…Table IV summarizes possible faults caused by corresponding transistor stuck-on (AT on ) and bridge defects, where x and y in W DF (x, y), dW DF (x, y), and CF st (x, y) denote the state of aggressor and victim. Some of faults are also defined in existing works [10]- [13]. However, we found two new faults, write disturbance fault (W DF ) and dynamic write disturbance fault (dW DF ), existing in 1T1R memristor memories.…”
Section: R(m)mentioning
confidence: 82%
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“…Table IV summarizes possible faults caused by corresponding transistor stuck-on (AT on ) and bridge defects, where x and y in W DF (x, y), dW DF (x, y), and CF st (x, y) denote the state of aggressor and victim. Some of faults are also defined in existing works [10]- [13]. However, we found two new faults, write disturbance fault (W DF ) and dynamic write disturbance fault (dW DF ), existing in 1T1R memristor memories.…”
Section: R(m)mentioning
confidence: 82%
“…Several works have addressed the defect analysis and testing of memristor memories [10]- [13]. In [10], a framework of defect oriented testing in 1R memristor memory based on electrical simulation was proposed.…”
Section: Introductionmentioning
confidence: 99%
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“…However, due to its immature manufacture process, memristive crossbar is prone to defects and requires efficient test methods for precise fault models with short test time. A number of test methods and fault models are proposed to test memristive crossbar [2,3,4,5] till now. The modeled faults can be classified as single-cell faults and coupling faults [2].…”
Section: Introductionmentioning
confidence: 99%
“…A coupling fault is defined as a transition in a cell (called aggressor cell) causing an unexpected change in another cell (called victim cell). In 1R crossbar, a coupling fault only occurs for the cells on adjacent wires in the same layer [4]. Kannan et al modeled the defects in a memristor caused by parametric variations during its fabrication [2].…”
Section: Introductionmentioning
confidence: 99%