Design and test of an optoelectronic-vlsi chip with 540-element receiver-transmitter arrays using differential optical signaling

Venditti, Michael B.; Laprise, Emmanuelle; Faucher, J.; Laprise, P.-O.; Lugo, J.; Plant, David V.

doi:10.1109/jstqe.2003.812512

Cited by 25 publications

(16 citation statements)

References 40 publications

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“…Device arrays with several thousand elements were demonstrated [108]. Other work used vertical cavity surface emitting laser (VCSEL) arrays (e.g., [102], [103], [106]). …”

Section: B)mentioning

confidence: 99%

Device Requirements for Optical Interconnects to Silicon Chips

2009

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Abstract-We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects to future high performance silicon chips. Optics has potential benefits in interconnect density, energy and timing. The necessity of low interconnect energy imposes low limits especially on the energy of the optical output devices, with a ~ 10 fJ/bit device energy target emerging. Some optical modulators and radical laser approaches may meet this requirement. Low (e.g., a few fF or less) photodetector capacitance is important. Very compact wavelength splitters are essential for connecting the information to fibers. Dense waveguides are necessary on-chip or on boards for guided wave optical approaches, especially if very high clock rates or dense WDM are to be avoided. Free space optics potentially can handle the necessary bandwidths even without fast clocks or WDM. With such technology, however, optics may enable the continued scaling of interconnect capacity required by future chips.

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“…Device arrays with several thousand elements were demonstrated [108]. Other work used vertical cavity surface emitting laser (VCSEL) arrays (e.g., [102], [103], [106]). …”

Section: B)mentioning

confidence: 99%

Device Requirements for Optical Interconnects to Silicon Chips

2009

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“…A 540-element array with 1080 VCSELs has been produced for optical interconnect in which each pixel can be modulated in excess of 200 Mbps [21]. An integrated solid-state array of transceivers has been designed to operate at 155 Mbps per pixel, where arrays of resonant cavity light-emitting diodes are bonded to arrays of CMOS driver circuits [22].…”

Section: Spatial Discrete Multitone Modulationmentioning

confidence: 99%

Two-dimensional binary halftoned optical intensity channels

Mohamed¹,

Hranilovic²

2008

IET Commun.

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This paper considers the capacity of two-dimensional optical intensity channels in which transmit images are constrained to be binary-level. Examples of such links exist in holographic storage, page-oriented memories, optical interconnects, two-dimensional barcodes, as well as MIMO wireless optical links. Data are transmitted by sending a series of time-varying binary-level optical intensity images from transmitter to receiver. Strict spatial alignment between transmitter and receiver is not required nor is independence among the spatial channels assumed. Our approach combines spatial discrete multitone modulation developed for spatially frequency selective channels with halftoning to produce a binary-level output image. Data is modulated in spatial frequency domain as dictated by a water pouring spectrum over the optical transfer function as well as channel and quantization noise. A binary-level output image is produced by exploiting the excess spatial bandwidth available at the transmitter to shape quantization noise out of band. We present a general mathematical framework in which such systems can be analyzed and designed. In a pixelated wireless optical channel application, halftoning achieves 99.8% of the capacity of an equivalent unconstrained continuous amplitude channel using 1 megapixel arrays.

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“…Fortunately, the size of VCSEL arrays does not have an obvious technologically imposed limitation that is practically relevant. 12 Yet, with ever larger array sizes there is an increasing risk of one of the VCSEL sources failing prematurely thereby reducing the array's throughput or possibly rendering the entire module useless. Such concerns may be addressed by providing backup VCSELs held in reserve within each array cell.…”

Section: Introductionmentioning

confidence: 99%

Toward redundant 2D VCSEL arrays for optical datacom

Roscher

Michalzik

2004

SPIE Proceedings

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We have developed technologies that bring functional redundancy to flip-chip mounted 850 nm backside-emitting high-speed VCSEL arrays with 250 µm channel pitch. A self-aligned dry-etch process results in vertical mesa sidewalls facilitating extremely narrow gaps as small as 2 µm between adjacent mesas, and even smaller gaps seem possible with this technology. Very dense intra-cell arrangements of oxide-confined circular and pie-shaped VCSELs were fabricated with minimal current aperture center-to-center distances of 20 µm and 17 µm, respectively. The paper also gives a first theoretical approximation of the additional coupling loss introduced by the inevitable radial VCSEL-fiber displacement for a 10 µm VCSEL coupling into a standard 50 µm fiber channel under varying offset launch conditions. We also present 4 × 8 and 8 × 8 regular arrays directly hybridized onto silicon carrier chips by means of an indium solder based flip-chip technology. The elimination of thermal bottlenecks by direct mesa bonding cuts the thermal resistance by half to about 1.3 K/mW for 10 µm devices as compared to offset-bonded devices.

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Design and test of an optoelectronic-vlsi chip with 540-element receiver-transmitter arrays using differential optical signaling

Cited by 25 publications

References 40 publications

Device Requirements for Optical Interconnects to Silicon Chips

Device Requirements for Optical Interconnects to Silicon Chips

Two-dimensional binary halftoned optical intensity channels

Toward redundant 2D VCSEL arrays for optical datacom

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