Two-dimensional parallel optical interconnects (2-D-POIs) are capable of providing large connectivity between elements in computing and switching systems. Using this technology we have demonstrated a bidirectional optical interconnect between two printed circuit boards containing optoelectronic (OE) very large scale integration (VLSI) circuits. The OE-VLSI circuits were constructed using vertical cavity surface emitting lasers (VCSELs) and photodiodes (PDs) flip-chip bump-bonded to a 0.35m complementary metal-oxide-semiconductor (CMOS) chip. The CMOS was comprised of 256 laser driver circuits, 256 receiver circuits, and the corresponding buffering and control circuits required to operate the large transceiver array. This is the first system, to our knowledge, to send bidirectional data optically between OE-VLSI chips that have both VCSELs and photodiodes cointegrated on the same substrate.

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We have constructed an optoelectronic very-largescale integration (OE-VLSI) chip with a 540-element receiver and transmitter array. Differential optical signaling was used in conjunction with a fully differential electrical architecture for the receiver and transmitter circuits. The chip was partitioned into multiple functional channels to demonstrate different chip-to-chip communication functions appropriate for applications of OE-VLSI technology. Wide optical input-output busses were provided for each channel in order to demonstrate high degrees of parallelism. The architecture and design of the chip are described in detail, including the digital functionality, the optoelectronic devices, and the arrays of receiver and transmitter circuits. The design verification of the chip is also described. We present experimental results that both verify the full functionality of the chip design and verify that the receiver and transmitter circuits and digital circuitry met their designed performance targets.

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