&lt;title&gt;Design, implementation, and characterization of a 2D bidirectional free-space optical link&lt;/title&gt;

Châteauneuf, Marc; Venditti, Michael B.; Laprise, Emmanuelle; Faucher, J.; Razavi, K.E.; Thomas-Dupuis, Frédéric; Kirk, Andrew G.; Plant, David V.; Yamamoto, Tsuyoshi; Trezza, J. A.; Luo, Wenbin

doi:10.1117/12.386872

Cited by 9 publications

(7 citation statements)

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“…While the demonstration of [2] used bulk optics to deliver light between ICs, designs have been investigated utilizing both rigid optical links [16] optimized to be misalignment tolerant (useful for chip-to-chip links on a board), and flexible fiber image guides [12,17] (useful for board-to-board links). Given the vertical nature of the VCSEL process, both approaches require connection to the top of the arrays.…”

Section: Optical Technologymentioning

confidence: 99%

VLSI Photonic Ring Multicomputer Interconnect: Architecture and Signal Processing Performance

Chamberlain

Franklin

Krishnamurthy

et al. 2005

J VLSI Sign Process Syst Sign Image Video Technol

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This paper presents the architectural design of a multicomputer interconnection network based on the use of optical technology. The performance of the system is evaluated on a set of signal processing applications. The interconnect uses Vertical Cavity Surface Emitting Lasers (VCSELs) and flexible fiber image guides to implement a physical ring topology that is logically configured as a multiring. Processors in the multicomputer are nodes on the ring and extremely high communication bandwidth is possible. Using the Laser Channel Allocation (LCA) algorithm and the Deficit Round Robin (DRR) media access protocol, the bandwidth available in the optical interconnect can be reconfigured to make efficient use of the interconnect resources. A discrete-event simulation model of the interconnect is used to examine performance issues such as throughput, latency, fairness, and the impact of reconfigurability.

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Section: Optical Technologymentioning

confidence: 99%

VLSI Photonic Ring Multicomputer Interconnect: Architecture and Signal Processing Performance

Chamberlain

Franklin

Krishnamurthy

et al. 2005

J VLSI Sign Process Syst Sign Image Video Technol

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“…In this system, the VCSELs arrays and photodiode arrays were flip-chip bonded to a CMOS chip using heterogeneous integration techniques. Although the demonstration of [16] used bulk optics to deliver light between ICs, optical paths have been designed using both rigid optical links [5] (useful for chipto-chip links on a board), and flexible fiber imaging guides [9] (useful for board-to-board links).…”

Section: A Photonic Multiringmentioning

confidence: 99%

Interconnection Networks

Bermond¹

2011

Algorithms and Parallel Computing

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“…With a 32 × 32 array operating at 1 Gb/s per laser, the aggregate data rate is 1 Tb/s. The demonstration of a link for a 16 × 32 array (with interdigitated VCSELs and detectors) is described by Chateaunneuf et al [4]. In this system, 2-D microlense arrays are used above the individual VCSELs to collimate the beams, and mini-lense arrays are used horizontally between the mirrors to provide tolerance to misalignment (an important consideration for commercial viability).…”

Section: Optical Technologymentioning

confidence: 99%

“…In these systems, the VCSEL and photodiode arrays are flip-chip bonded to CMOS chips using heterogeneous integration techniques. Although Plant's demonstration used bulk optics to deliver light between ICs, the free space optical path for a viable system design could use either a rigid optical link [4] (useful for chip-tochip links on a board), shown in Figure 2(a), or a flexible fiber imaging guide [5,6] (useful for boardto-board or chip-to-chip links), shown in Figure 2(b).…”

Section: Optical Technologymentioning

confidence: 99%