Designers
of electronic devices and telecommunications equipment have used different
methods (e.g., three-dimensional chip architecture, comprised of a
vertically integrated stack of chips) to increase the number of transistors
on integrated circuits. These latest chips generate excessive amounts
of heat and thus can reach unacceptably high temperatures. In this
context, this research aims to develop thermally conductive liquid
crystal polymer (LCP)-hexagonal boron nitride (hBN) composite films
to replace the traditionally used Kapton films that satisfy the electrical
insulation requirements for the attachment of heat sinks to the chips
without compromising the heat dissipation performance. Experimental
simulations show that the maximum temperature of the heater mounted
with a hybrid heat sink reduced with increased hBN content. Furthermore,
a sufficient slow cooling process in the fabrication stage of the
LCP/hBN composite films promotes the fibrillation of LCP matrix, leading
to highly ordered structure and promoted the composite’s heat
dissipation ability.