Design concepts of high energy punchthrough structures

Kannam, P.J.

doi:10.1109/t-ed.1976.18502

Cited by 12 publications

(1 citation statement)

References 6 publications

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“…The broken curves show the extent to which the maximum temperature can be reduced by infinite heat sinking on both sides. Kannam (1976) has examined the performance of a range of punch-through diodes, when subjected to single 20 ms power pulses, and has published results of maximum power density. When his devices are modelled using TLM, it is found that the maximum temperatures are at least an order of magnitude less than that required for destruction.…”

Section: Most Of the Calculations Have Been Basedmentioning

confidence: 99%

The calculation of temperature distribution in punch-through structures during pulsed operation using the transmission line modelling (TLM) method

Cogan

John

1982

J. Phys. D: Appl. Phys.

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Finite difference methods are frequently used to model heat flow in semiconductors. However space and time discretisation of the heat equation introduces errors. The transmission line modelling technique (TLM) is a useful alternative in that it solves an equivalent electrical network exactly. The extent of error depends only on how well an equivalent electrical network matches a physical problem. The TLM method has been used to model the behaviour of punch-through diodes during pulsed operation. The results indicate that the mechanism of heat dissipation within the active region of this type of device will have to be described more accurately if agreement between theory and experiment is to be obtained.

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Section: Most Of the Calculations Have Been Basedmentioning

confidence: 99%