Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers

Sun, Yunheng; Jin, Yufeng; Lian, Tingting; Ma, Shenglin; Yang, Yea Ru; Wang, Wei; Hu, Lei; He, Shuchang

doi:10.1109/ectc32862.2020.00347

Cited by 3 publications

(1 citation statement)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, the selection for MMW SiP is a tradeoff among compactness, cost, electrical performance and thermo-mechanical reliability [26]. Taking the advantages of high precision and short interconnection, SiP technology based on silicon process is a promising candidate for the realization of a low-cost, fully integrated MMW transceiver system [27,28,29,30,31]. However, more effort is needed to achieve high density integration of T/R modules and antenna array with broadband interconnection for E-band applications.…”

Section: Introductionmentioning

confidence: 99%

Si-based system-in-package design with broadband interconnection for E-band applications

Chu

Zhou

et al. 2021

IEICE Electron. Express

View full text Add to dashboard Cite

This letter presents a silicon-based package design for E-band communication systems. As the primary concern to package, the radiofrequency (RF) interconnection from carrier board to the die is carefully designed based on the impedance transformation characteristic of the transmission line (TL). In addition, the simulation results show that the designed interconnection is robust to moderate process deviations. To verify the electrical performance of the designed interconnection, a dummy testing structure is designed, fabricated and measured. The measurement results show that the return loss is less than −10.6 dB in the commercial communication frequency range of 71-86 GHz for E-band applications.

show abstract