Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

Abstract

Embedded passives provide a practical solution to microelectronics miniaturization. In a typical circuit, over 80 percent of the electronic components are passives such as resistors, inductors, and capacitors that could take up to 50 percent of the entire printed circuit board area. By integrating passive components within the substrate, embedded passives reduce the system real estate, eliminate the need for discrete components and assembly of same, enhance electrical performance and reliability, and potentially reduce the overall cost. Moreover, it is lead free. Even with these advantages, embedded passive technology is at a relatively immature stage and more characterization and optimization are needed for practical applications leading to its commercialization. This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated by Packaging Research Center (PRC) and Endicott Interconnect Technologies (EI). Resistors are carbon ink based Polymer Thick Film (PTF) andNiCrAlSi, and capacitors are made with polymer/ceramic nanocomposite material. High frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JEDEC standards are presented.

Effects of moisture absorption on the electrical parameters of embedded capacitors with epoxy-BaTiO3 nanocomposite dielectric

“…It was observed that after 1,000 h of reliability testing at 85°C and 85% RH, the capacitance increased by about 4% [17]. In another work, capacitance was found to increase by about 10% after 4 h of pressure cooker testing (121°C and 100% RH) [18].…”

Reliability of Embedded Planar Capacitors With Epoxy–$\hbox{BaTiO}_{3}$ Composite Dielectric During Temperature–Humidity–Bias Tests

“…The reliability of embedded capacitors with polymerceramic composite dielectric under elevated temperature and humidity conditions (85 • C and 85% RH) has been investigated [22]. After 100 h of elevated temperature and humidity tests, the capacitance was found to increase by about 4%.…”

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

“…The board is fully cured at 150 C for 1 h to complete the capacitor process. Once the capacitor layer is completed, resistor layer is fabricated using a screen print lift-off process followed by the electroplated microvia process to complete the TV2 fabrication [11].…”