Design, fabrication, and testing of a helical antenna using 3D printing technology

Ghassemiparvin, Behnam; Ghalichechian, Nima

doi:10.1002/mop.32184

Cited by 18 publications

(10 citation statements)

References 8 publications

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“…Such elliptical shape can be self‐supported during SLM printing, and therefore no additional support structures are required. This eases the fabrication, as the metal support structures are difficult to remove 16,17 . The length of the waveguide also plays a dominant role in determining the attenuation, that is, the longer the waveguide, the greater the attenuation.…”

Section: Design and Fabrication Of Waveguide Attenuatorsmentioning

confidence: 99%

“…The printing orientation, as indicated in Figure 3A, was chosen to eliminate the need for additional metallic support inside the waveguides. This is important in that any internal metallic support is very difficult to remove 16,17 . The metallic support generated outside the waveguides can be removed manually.…”

Section: Design and Fabrication Of Waveguide Attenuatorsmentioning

confidence: 99%

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3‐D printed waveguide attenuators operating at ka‐band (26.5‐40 GHz)

Wang

Guo

Shang

et al. 2020

Micro & Optical Tech Letters

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In this article, two Ka‐band (26.5‐40 GHz) waveguide attenuators designed for three‐dimensional (3‐D) metal printing are presented. These designs are based on long waveguides with elliptical cross‐sections, so that the waveguide structure can be self‐supported during printing. Bended waveguide and helical waveguide are utilized by the two attenuators, respectively, to achieve reduced overall sizes. The attenuations are fixed, however, these can be altered by varying the length/height of waveguides. The limitation of 3‐D metal printing process on surface roughness is also used to provide attenuation. Therefore, the proposed attenuators can cope with printing process with relatively poor surface finish. The prototype designs are fabricated using a metallic selective laser melting (SLM) process and are measured to have good electrical performance across the full waveguide band. The measured attenuation values are in the range of 3.7 to 6.3 dB for the bended waveguide attenuator and 4.3 to 6.3 dB for the helical waveguide attenuator. Both attenuators are measured to have a good return loss (S11 < −20 dB) across the whole Ka‐band. This demonstrates that 3‐D metal printed attenuators could be an attractive alternative to the conventional designs based on absorbing materials, particularly for applications demanding high powers.

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Section: Design and Fabrication Of Waveguide Attenuatorsmentioning

confidence: 99%

Section: Design and Fabrication Of Waveguide Attenuatorsmentioning

confidence: 99%

3‐D printed waveguide attenuators operating at ka‐band (26.5‐40 GHz)

Wang

Guo

Shang

et al. 2020

Micro & Optical Tech Letters

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“…e additive process includes three-dimensional (3D) printing and two-dimensional (2D) inkjet printing. Among them, 3D printing shows the potential for facilitating spatial complex design [2], whereas inkjet-printing advances conventional printed circuit boards (PCBs) due to the directwrite feature, low fabrication cost, and the application of flexible, light, or environmental friendly substrates. Inkjet printing has served a wide range of EM applications, including antenna-in-package (AiP) applications [3], substrate integrated waveguide (SIW) circuits and antennas [4][5][6], flexible antennas [7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24] including origami [7][8][9][10][11] and wearable applications [12,17,21,24], radiofrequency identification (RFID) tags [25] and the chipless counterpart [26], and wireless sensors [27].…”

Section: Introductionmentioning

confidence: 99%

Performance Enhancements of Fully Inkjet-Printing Technology for Antenna-in-Package and Substrate Integrated Waveguides

Chen

Huang

2022

International Journal of Antennas and Propagation

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A fully inkjet-printing technology is applied to antenna-in-package (AiP) and substrate integrated waveguide (SIW) to enhance the performance of three components, including via holes, wire bonding, and flexible antenna arrays. First of all, earlier studies utilize shorting pins for the conductive pathway in high-density AiP and SIW, but this requires an additional procedure to plate the conductor. We propose a mechanical approach to form a cylindrical hole, plating the surface with silver nanoparticles and realizing the equivalent circuit model of the shorting pin. The proposed approach does not require high alignment sensitivity or the precise control of laser power level. Second, fully inkjet-printed wire bonding is proposed for the system on the package. The proposed technique not only reduces the discontinuity but also enables a fabrication without additional assembly. Third, the proposed technique is implemented for antenna development, which shows desirable performance with reduced fabrication complexity. The proposed technology is validated by microstrip lines, SIWs, SIW cavity slots, and flexible 4 × 4 patch arrays fabricated on various substrates including RO 4003C, polyimide, and polyethylene naphthalate. For comparison purposes, conventional approaches using printed circuit boards are also implemented and tested. The results indicate the generality and capability of the proposed technique.

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“…Recently, several studies were performed to explore the opportunity to cover 3D-printed structures with metallic coatings for different purposes, such as the achievement of a good level of conductivity for rapid-prototyped polymers [14], the fabrication of 3D-printed helical and spiral antennas [15,16], and the development of electroluminescent devices [17]. For 3D-printed parts, the presence of a metallic coating enables the improvement of material properties, such as aesthetics, while also changing the user perception of 3D-printed polymers [13,18].…”

Section: Introductionmentioning

confidence: 99%

Metallization of Thermoplastic Polymers and Composites 3D Printed by Fused Filament Fabrication

Romani

Mantelli

Tralli³

et al. 2021

Technologies

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Fused filament fabrication allows the direct manufacturing of customized and complex products although the layer-by-layer appearance of this process strongly affects the surface quality of the final parts. In recent years, an increasing number of post-processing treatments has been developed for the most used materials. Contrarily to other additive manufacturing technologies, metallization is not a common surface treatment for this process despite the increasing range of high-performing 3D printable materials. The objective of this work is to explore the use of physical vapor deposition sputtering for the chromium metallization of thermoplastic polymers and composites obtained by fused filament fabrication. The thermal and mechanical properties of five materials were firstly evaluated by means of differential scanning calorimetry and tensile tests. Meanwhile, a specific finishing torture test sample was designed and 3D printed to perform the metallization process and evaluate the finishing on different geometrical features. Furthermore, the roughness of the samples was measured before and after the metallization, and a cost analysis was performed to assess the cost-efficiency. To sum up, the metallization of five samples made with different materials was successfully achieved. Although some 3D printing defects worsened after the post-processing treatment, good homogeneity on the finest details was reached. These promising results may encourage further experimentations as well as the development of new applications, i.e., for the automotive and furniture fields.

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Design, fabrication, and testing of a helical antenna using 3D printing technology

Cited by 18 publications

References 8 publications

3‐D printed waveguide attenuators operating at ka‐band (26.5‐40 GHz)

3‐D printed waveguide attenuators operating at ka‐band (26.5‐40 GHz)

Performance Enhancements of Fully Inkjet-Printing Technology for Antenna-in-Package and Substrate Integrated Waveguides

Metallization of Thermoplastic Polymers and Composites 3D Printed by Fused Filament Fabrication

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