Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer

Abstract

The new generation of data centers is further evolving towards the direction of high speed and intelligence, which puts forward a great demand for the iteration of optical interconnection technology. Three-dimensional integration based on active photonic interposers can achieve the advantages of high integration, high bandwidth and low power consumption, which has become the main direction for next generation optical module technology. The fabrication and assembly of 3D optical modules based on active interposer-integrated edge couplers and TSV are realized in this paper. Different active interposer processes with integrated edge couplers and RDL-TSV-RDL structures are discussed, manufactured, analyzed and evaluated. The problem of the co-fabrication of the TSV and edge coupler was solved, and perfect electrical and optical characteristics were also achieved. Finally, the fabrication of the substrate and the assembly of the 3D optical module were completed. This paper lays a solid foundation for the further research and large-scale application of 3D optical modules in the future.

Research of Vertical via Based on Silicon, Ceramic and Glass

“…Moreover, the smaller the TSV depth, the corresponding interconnection delay and loss will also be reduced. After the thinning of the TSV transfer substrate, it is generally necessary to expose the TSV copper column from the back by a dry or wet etching process so as to realize the electrical signal connection on the back of the subsequent wafer [ 40 ]. Generally, there are two methods: dry process and wet process.…”

Special Issue “Building Three-Dimensional Integrated Circuits and Microsystems”

“…Three-dimensional integration based on active photonic interposers can achieve the advantages of a high integration, high bandwidth, and low power consumption, which has become the main direction for next-generation optical module technology. For example, the author designed and verified the fabrication of optical transceivers and the 3D assembly of the modules integrated with edge couplers and RDL-TSV-RDL in [1], achieving ideal high frequency characteristics and extremely low optical coupling loss and the compatibility challenge of TSV and edge coupler fabrication. Different manufacturing processes are selected, verified, and optimized.…”