“…Recently, the trend towards miniaturizing semiconductor products such as integrated chips and MEMS has stimulated extensive research on semiconductor packaging (Aized and Shirinzadeh, 2011;Fatikow et al, 2008;Li and Xu, 2011;Liaw et al 2008;Wang et al, 2009b;Zhang et al, 2013). As one of the essential components of semiconductor packaging machines, high speed XY positioning stage with a micro scale resolution and motion stroke of over several millimeters plays an important role in the packaging process (Hwang et al, 2010;Liang et al, 2010;Wang et al, 2011Wang et al, , 2014.…”