The 2010 IEEE International Conference on Information and Automation 2010
DOI: 10.1109/icinfa.2010.5512269
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Design of a compliant XY stage with embedded force sensor for micro-scale positioning

Abstract: This paper presents the development of a micro-scale positioning device based on two degrees of freedom (DOF) plane compliant parallel mechanism, which is featured by piezo-driven actuators and flexure joints, integrated force/torque sensor that capable of delivering 2-DOF motions with high precision and providing real-time force/torque or position information for feedback control. With optimization design, the proper parameters of the proposed structure and flexure joints are chosen. The stage possesses high … Show more

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Cited by 4 publications
(1 citation statement)
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“…Recently, the trend towards miniaturizing semiconductor products such as integrated chips and MEMS has stimulated extensive research on semiconductor packaging (Aized and Shirinzadeh, 2011;Fatikow et al, 2008;Li and Xu, 2011;Liaw et al 2008;Wang et al, 2009b;Zhang et al, 2013). As one of the essential components of semiconductor packaging machines, high speed XY positioning stage with a micro scale resolution and motion stroke of over several millimeters plays an important role in the packaging process (Hwang et al, 2010;Liang et al, 2010;Wang et al, 2011Wang et al, , 2014.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, the trend towards miniaturizing semiconductor products such as integrated chips and MEMS has stimulated extensive research on semiconductor packaging (Aized and Shirinzadeh, 2011;Fatikow et al, 2008;Li and Xu, 2011;Liaw et al 2008;Wang et al, 2009b;Zhang et al, 2013). As one of the essential components of semiconductor packaging machines, high speed XY positioning stage with a micro scale resolution and motion stroke of over several millimeters plays an important role in the packaging process (Hwang et al, 2010;Liang et al, 2010;Wang et al, 2011Wang et al, , 2014.…”
Section: Introductionmentioning
confidence: 99%