Design of a Non-Contact Vertical Transition for a 3d Mm-Wave Multi-Chip Module Based on Shielded Membrane Supported Interconnects

Abstract

Abstract-The preliminary design concept, for a low-loss, highbandwidth electromagnetically coupled vertical transition for use as a via between adjacent levels of a 3D-MCM based on membranesupported striplines with micro-machined shielding, is presented. The design methodology, modeling using Ansoft HFSS and simulated results are presented and together represent a complete electrical characterization of the vertical transition. The simulated insertion loss of these structures is shown to be as low as 0.12 dB at 60 GHz with a 44 GHz 1 dB bandwidth. Besides studying the vertical transition, the analysis is extended to identify the range of directional coupling which can be achieved using this type of structure, which is shown to be greater than 3 dB. The structures studied rely on a versatile micromachining technique for the fabrication of the micro-shielding which allows for the conformal packaging of lines and devices, with the ultimate aim of realizing 3D system-in-a-package type modules. The concept and proposed fabrication techniques for these modules, including methods of flip-chip MMIC attachment are detailed.

Multilayer microwave integrated quantum circuits for scalable quantum computing

“…[36][37][38] To route signal communication between layers, MMIQCs must contain superconducting versions of layer-to-layer RF interconnects. [39,40] Coupling of the cavity res-onators to one another or to planar transmission lines is achieved, for instance, through apertures in the metalization of the enclosure through which electromagnetic field radiates, as implemented in microwave cavities and multi-cavity filters. [32][33][34] In the MMIQC, superconducting transmission lines and interconnects based on these existing technologies will be further engineered to provide the large range of necessary couplings and minimize any parasitic losses.…”