“…Among those sensors having some degree of integration, none can be fabricated without changes to the standard CMOS process: breaking some design rules, adjusting process steps/sequence or by performing post-processing steps [ 1 , 2 , 4 , 5 , 7 , 10 , 11 , 12 , 17 , 18 ]. Besides the uncooled thermal image sensors, there have been developments in the cooled infrared sensors, even though they are more expensive and usually not integrated with CMOS signal processing circuits [ 21 , 22 , 23 , 24 , 25 , 26 ]. These thermal image sensors have been developed to acquire images of objects at a distance, that is, not in contact with the sensor, and based on microbolometers, quantum-well detectors, and materials other than silicon, resulting in imagers with reduced resolution compared to cameras for the visible spectrum.…”