Design of a Thermal-Bubble-Based Micromachined Accelerometer

Liao, Ke-Min; Chen, Rongshun; Chou, Bruce

doi:10.1109/icmens.2005.133

Cited by 4 publications

References 6 publications

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RFID-based thermal convection accelerometer

Lin

2012

2012 IEEE Sensors

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This research proposes a wireless RFID-based thermal convection accelerometer, and relates for the technology to manufacture and package it on a flexible substrate, such as polyimide to withstand the temperature (400K) of heater. The key technology is to integrate RFID chip, a wireless RFID antenna, and a thermal convection accelerometer on the same substrate. The heaters and the thermal sensors are made on the flexible substrate with the traditional floating structure. Since the thermal conductivity of the traditional S i is 1.48 W/(cm-K), it is 25 times of the proposed flexible substrate, i.e. 0.06-0.0017 W/(cm-K), thus the power leakage through the substrate can be saved by the new design. Comparisons are also made by filling the chamber with the traditional carbon dioxide (CO 2 ) and the proposed xenon (Xe) gases. Note the sensitivity by using CO 2 gas is larger for accelerations lower than 16G, but it saturates beyond this acceleration. While the sensitivity for the new design by using Xe gas is lower, but it saturates at a larger acceleration, i.e. 25G. Note the step-input response times of 25G and 16G with Xe gas are quicker, i.e. 104 and 122µs, respectively.

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RFID-based thermal convection accelerometer

Lin

2012

2012 IEEE Sensors

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A New Approach of 2D CMOS Thermal-Bubble-Based Accelerometer

Yang

Chen

Lin

et al. 2007

IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society

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A novel thermal-bubble-based micromachined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35 tm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.

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