2014 17th Euromicro Conference on Digital System Design 2014
DOI: 10.1109/dsd.2014.80
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Design of an Embedded Health Monitoring Infrastructure for Accessing Multi-processor SoC Degradation

Abstract: An embedded health-monitoring infrastructure for a highly reliable MP-SoC for data-streaming systems is presented. Different from the traditional approach of a dependable design, our infrastructure is based on life-time prognostics from healthmonitoring sensors that are embedded near the target processor. This enables the preventive repair by spare parts or priority ranking of tasks among processors. Focus of this paper is mainly the health-monitoring scheme and the sensor structure with simulation results.

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Cited by 7 publications
(5 citation statements)
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“…Another study presented a healthcare system architecture that addresses dynamic behaviour and various traffic in WBAN [62]. Another study was focused on scheme of health tracking and on sensor structure with simulated results [63]. Another study attempted to enhance the quality of the Telehealth system through its proposed infrastructure [64].…”
Section: Sensor Based (Tier 1)mentioning
confidence: 99%
“…Another study presented a healthcare system architecture that addresses dynamic behaviour and various traffic in WBAN [62]. Another study was focused on scheme of health tracking and on sensor structure with simulated results [63]. Another study attempted to enhance the quality of the Telehealth system through its proposed infrastructure [64].…”
Section: Sensor Based (Tier 1)mentioning
confidence: 99%
“…In this case an IRF is being detected by a transition detection circuit (TDC, Fig. 9), a°a g is raised to enable the measurement of the most local temperature, e.g., via a diode-based or our ring-oscillator embedded instrument 18 determined, e.g., also via our multi-purpose ring oscillator. 18 Several high risk regions, e.g., many serial vias or TSVs, can be determined by inductive fault analysis (IFA) techniques.…”
Section: Data Logging Time Stamps and Environmental Conditionsmentioning
confidence: 99%
“…9), a°a g is raised to enable the measurement of the most local temperature, e.g., via a diode-based or our ring-oscillator embedded instrument 18 determined, e.g., also via our multi-purpose ring oscillator. 18 Several high risk regions, e.g., many serial vias or TSVs, can be determined by inductive fault analysis (IFA) techniques. 19 Any vibration could be monitored via existing MEMS-based sensors, 20 not necessarily locally integrated on-chip or even on top of the chip but, for example, located on the SoC-housing PCB.…”
Section: Data Logging Time Stamps and Environmental Conditionsmentioning
confidence: 99%
“…At almost the same time the local power-supply Vdd is determined, e.g. also via our multipurpose ring oscillator [15]. Several high risk regions, e.g.…”
Section: Data Logging Time Stamps and Environmental Conditionsmentioning
confidence: 99%
“…via a diodebased or our ring-oscillator embedded instrument [15] possibly using the IJAG standard IEEE 1687. At almost the same time the local power-supply Vdd is determined, e.g.…”
Section: Data Logging Time Stamps and Environmental Conditionsmentioning
confidence: 99%