Design of Compact Dual-Band LTCC Second-Order Chebyshev Bandpass Filters Using a Direct Synthesis Approach

Pourzadi, Aref; Isapour, Aria; Kouki, Ammar B.

doi:10.1109/tmtt.2019.2898197

Cited by 24 publications

(3 citation statements)

References 29 publications

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“…As one of the key components in radio frequency (RF) front ends and microwave systems, bandpass filters (BPFs) are extensively investigated and have spurred great advances in terms of structures, processes, and performance over the past decades. Several technologies such as low temperature co-fired ceramic (LTCC) [ 1 , 2 ], microstrip [ 3 , 4 , 5 , 6 ], substrate integrated waveguide (SIW) [ 7 , 8 , 9 ], and micro-electromechanical systems (MEMS) [ 10 , 11 ], are utilized to develop BPFs with specific characteristics such as broad bandwidth, high selectivity, low insertion loss, and compact size. Recently, with the rapid development of wireless communication, Internet of Things (IoT), and Artificial Intelligence (AI), the demands for miniaturization and integration of RF components are especially urgent, therefore, it is necessary to design filters that are more compact and easier to be integrated [ 12 , 13 , 14 , 15 ].…”

Section: Introductionmentioning

confidence: 99%

Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology

et al. 2023

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Three-dimensional (3D) integration based on through-silicon-via (TSV) technology provides a solution to the miniaturization of electronic systems. In this paper, novel integrated passive devices (IPDs) including capacitor, inductor, and bandpass filter are designed by employing TSV structures. For lower manufacturing costs, polyimide (PI) liners are used in the TSVs. The influences of structural parameters of TSVs on the electrical performance of the TSV-based capacitor and inductor are individually evaluated. Moreover, with the topologies of capacitor and inductor elements, a compact third-order Butterworth bandpass filter with a central frequency of 2.4 GHz is developed, and the footprint is only 0.814 mm × 0.444 mm. The simulated 3-dB bandwidth of the filter is 410 MHz, and the fraction bandwidth (FBW) is 17%. Besides, the in-band insertion loss is less than 2.63 dB, and the return loss in the passband is better than 11.4 dB, showing good RF performance. Furthermore, as the filter is fully formed by identical TSVs, it not only features a simple architecture and low cost, but also provides a promising idea for facilitating the system integration and layout camouflaging of radio frequency (RF) devices.

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Section: Introductionmentioning

confidence: 99%

Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology

et al. 2023

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“…In this context, the research of tunable filter with sharp selectivity is of great significance. The continuous development of manufacturing technology provides a strong support for the design of RF circuits, among which low temperature co‐fired ceramic (LTCC) has attracted more and more attention in the field of filter design 1‐3 . For instance, a compact tunable LTCC filter with high selectivity is a very suitable candidate for a receiver filter in a L‐band satellite system.…”

Section: Introductionmentioning

confidence: 99%

“…The continuous development of manufacturing technology provides a strong support for the design of RF circuits, among which low temperature co-fired ceramic (LTCC) has attracted more and more attention in the field of filter design. [1][2][3] For instance, a compact tunable LTCC filter with high selectivity is a very suitable candidate for a receiver filter in a L-band satellite system. In References 4-9, piezoelectric materials, ferrite materials, or MEMS are combined with LTCC for tunable filter design.…”

Section: Introductionmentioning

confidence: 99%

A tunable LTCC fourth‐order bandpass filter with high selectivity for L‐band satellite applications

Zhang

You

Jiao

et al. 2020

Micro & Optical Tech Letters

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This Letter presents a varactor‐loaded double‐layer coupled stripline resonator to implement compact fourth‐order tunable bandpass filter. The whole structure of the proposed resonator consists of two strongly coupled striplines, a metal post and a varactor with bias circuit. Strong capacitive coupling between the striplines at different layers is introduced to significantly reduce the resonator size. A detailed investigation on the relationship between the transmission line length and loading capacitance is presented. The stripline is connected to the varactor by the metal post so that the resonant frequency can be tuned. Through cross‐coupled technology, transmission zeros are introduced in the upper and lower out‐of‐bands of the filter using combline structure for high selectivity. One prototype bandpass filter has been designed to validate the principle, and the measured results show good agreement with the simulated ones. The designed fourth‐order filter has a size of <0.1 λg × 0.1 λg and a steep frequency response with the shape factor <1.7.

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Dual-Band Bandpass Filter Based on Electromagnetic Coupling of Twin Square Metamaterial Resonators (SRRs) and Complementary Resonator (CSRR) for Wireless Communications

Berka

Azzeddine

Bendaoudi

et al. 2021

Journal of Elec Materi

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Design of Compact Dual-Band LTCC Second-Order Chebyshev Bandpass Filters Using a Direct Synthesis Approach

Cited by 24 publications

References 29 publications

Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology

Design of a Novel Compact Bandpass Filter Based on Low-Cost Through-Silicon-Via Technology

A tunable LTCC fourth‐order bandpass filter with high selectivity for L‐band satellite applications

Dual-Band Bandpass Filter Based on Electromagnetic Coupling of Twin Square Metamaterial Resonators (SRRs) and Complementary Resonator (CSRR) for Wireless Communications

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