Design of Continuous Membrane Surface Micromachined Silicon Deformable Mirror for Adaptive Optics

Sharma, Renu; Yadav, Ishwar Chandra; Meena, Aklesh Kumar; Kumar, Manoj; Saxena, Ranjana; Jain, Kapil

doi:10.1007/978-3-319-97604-4_128

Cited by 2 publications

(2 citation statements)

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“…4. При подробном исследовании рельефа поверхности и формы МЭМС-структур и изделий на их основе: акселерометров [22], сенсоров давления [23], адаптивной оптики [24,25] и др. Здесь необходимо анализировать и начальную форму МЭМС, и ее изменение, как под действием ожидаемых функционально необходимых воздействий [25], так и под действием различных разрушающих факторов [26].…”

Section: международный симпозиум "unclassified

Методика Исследования Изменения Формы Пластин И Тонкопленочных Мембран С Использованием Геоморфометрических Подходов

Dedkova¹,

Флоринский²,

Дюжев³

2022

Журнал Технической Физики

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We discuss a technique for investigating changes in complex topography and shape of structures using geomorphometric methods to study surfaces of wafers and membranes formed by the Bosch process. The wafers were analyzed before and after the deposition of the SiO2 layer. The membranes were analyzed during the bulge testing. The study was carried out using maps of the catchment area and principal curvatures taking into account artifacts of the approximation of experimental data. We found a correspondence between the distribution of lines connecting the highest surface areas before and after the deposition of the SiO2 layer on the wafers. For membranes with structure: Al (0.8 μm)/SiO2 (0.6 μm)/Al (1.1 μm), pSi*(0.8 μm)/SiNx (0.13 μm)/SiO2, Al (0.6 μm) – we also found that features of membrane boundaries are mainly caused by their initial shape rather than change under the action of an applied pressure. The advantages of geomorphometry methods for studying changes in the shape of wafers and thin-film membranes in technological processes for the manufacturing of microelectronic devices are shown in comparison with traditional methods for analyzing surface topography maps.

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Section: международный симпозиум "unclassified

Методика Исследования Изменения Формы Пластин И Тонкопленочных Мембран С Использованием Геоморфометрических Подходов

Dedkova¹,

Флоринский²,

Дюжев³

2022

Журнал Технической Физики

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“…In a detailed study of the surface topography and shape of MEMS structures and products based on them: accelerometers [22], pressure sensors [23], adaptive optics [24,25] and others. Here it is necessary to analyze both the initial form of MEMS and its change, both under the influence of the expected functionally necessary influences [25], and under the influence of various destructive factors [26].…”

Section: Introductionmentioning

confidence: 99%

Technique for investigation of the shape changes of wafers and thin-film membranes by using geomorphometric approaches

2022

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We discuss a technique for investigating changes in complex topography and shape of structures using geomorphometric methods to study surfaces of wafers and membranes formed by the Bosch process. The wafers were analyzed before and after the deposition of the SiO2 layer. The membranes were analyzed during the bulge testing. The study was carried out using maps of the catchment area and principal curvatures taking into account artifacts of the approximation of experimental data. We found a correspondence between the distribution of lines connecting the highest surface areas before and after the deposition of the SiO2 layer on the wafers. For membranes with structure: Al(0.8 μm)/SiO2(0.6 μm)/Al(1.1 μm), pSi*(0.8 μm)/SiNx(0.13 μm)/SiO2, Al(0.6 μm) we also found that features of membrane boundaries are mainly caused by their initial shape rather than change under the action of an applied pressure. The advantages of geomorphometric methods for studying changes in the shape of wafers and thin-film membranes in technological processes for the manufacturing of microelectronic devices are shown in comparison with traditional methods for analyzing surface topography maps. Keywords: thin films, membrane, defect, mechanical characteristics, mechanical stresses, deformation, deflection, strain, microelectromechanical systems, MEMS, circular membrane, silicon substrate, optical profilometry, overpressure, geomorphometry, Gaussian curvature, warpage, principal curvatures, wafer, bulge testing, bulging method, thin-layer coating, digital elevation models, DEM, surface, topography.

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Design of Continuous Membrane Surface Micromachined Silicon Deformable Mirror for Adaptive Optics

Cited by 2 publications

References 1 publication

Методика Исследования Изменения Формы Пластин И Тонкопленочных Мембран С Использованием Геоморфометрических Подходов

Методика Исследования Изменения Формы Пластин И Тонкопленочных Мембран С Использованием Геоморфометрических Подходов

Technique for investigation of the shape changes of wafers and thin-film membranes by using geomorphometric approaches

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