Design of dual‐conductive polyacrylonitrile‐based composite nanofiber: Synergistic effect of copper nanoparticles decorated‐boron nitride and polyaniline

Abstract

Conductive composite nanofibers are promising materials, especially wearable strain sensors, due to their lightweight, breathability, flexibility, and skin affinity. Here, we propose a dual‐conductive network by the sequential decoration of amin‐modified boron nitride nanosheets (BN), copper nanoparticles (Cu), and polyaniline (PANI) into the elastic thermoplastic polyacrylonitrile (PAN) nanofiber. The Cu nanoparticles/BN‐enwrapped PANI nanocomposite was synthesized using successive environmentally friendly reduction and chemical oxidation polymerization. First, Cu (II) ions were immobilized on modified BN and reduced with L‐ascorbic acid (BN@Cu), followed by a chemical oxidation polymerization of aniline using ammonium persulfate as an initiator (BN@Cu/PANI). The XRD (X‐ray diffraction), FTIR (Fourier Transform Infrared Spectroscopy), SEM (Scanning Electron Microscopy), and TEM/EDXS (Transmission Electron Microscopy/Energy Dispersive X‐ray Spectroscopy) analysis confirmed the coexistence of the BN@Cu/PANI phase and composition. The DC electrical conductivity of BN@Cu/PANI nanocomposite (0.567 S/cm) was quietly higher than PANI (0.167 S/cm) and BN@Cu (0.077 S/cm). The thermal conductivity of BN@Cu and BN@Cu/PANI was 0.626 and 0.444 W/mK, respectively. The BN@Cu/PANI loaded‐PAN composite nanofibers were successfully produced by electrospinning. SEM studies confirmed that the composite nanofibers have uniform fiber structure and suitable BN@Cu/PANI dispersion/distribution within the PAN. BN@Cu/PANI‐reinforced PAN nanofibers showed a 2‐fold decrease in the specific heat capacity and a 50‐fold increase in electrical conductivity of the nanofibers at 10 wt%BN@Cu/PANI loading. This work offers dual‐conductive polymer‐based composites, which can be used in thermal management applications in microelectronics devices.Highlights The dual‐conductive nanocomposite, BN@Cu/PANI, was prepared a simple, low‐cost method. BN@Cu/PANI, core/shell nanocomposite, was easily produced this way for the first time. BN@Cu nanoparticles increased the polymerization rate of PANI. The thermal and electrical conductivity of BN@Cu/PANI was 0.444 W/mK and 0.567 S/cm. Electrical conductivity of BN@Cu/PANI‐PAN increased 50‐fold increase at 10 wt%BN@Cu/PANI.

Growth of polyaniline nanowire arrays on boron nitride microrods enables high‐efficient thermal transport

“…The second weight loss from 245 to 340°C can be attributed to the loss of HCl dopants in PANI chains 33 . The final weight loss starts at 483°C and ends at 583°C, which is due to the structural decomposition of the PANI molecular chain backbone 11 . In comparison, the BN@PANI composite displays a similar TGA curve as pure PANI, and a higher decomposition temperature of the PANI backbone (491°C) is observed, indicating better thermal stability.…”

“…The peak intensity of the (020) crystal plane in the BN@PANI composite is higher than that of pure PANI, indicating that the structure of PANI within a composite becomes more ordered. In addition, the peak at ∼26.7° is relevant to the periodicity perpendicular to the PANI chain 11 . In addition, the (100) peak in the BN@PANI composite is shifted to a higher angle compared to its original position in BN, implying a strong interfacial interaction between BN and PANI.…”

“…In comparison, the fabrication of CP‐based composites has attracted increasing interest recently on account of their advantages of simple processing, low cost, flexibility, and suitability for mass production in terms of enhancing the TC, which has become the mainstream direction of development in this field 9,10 . To date, different types of thermally conductive fillers such as metals, 11,12 ceramics, 13 and carbon‐based materials 14 were explored to fabricate CP‐based composites. For instance, Chen and co‐workers synthesized single‐walled carbon nanotubes (SWNTs)/PANI composite films by combining in situ polymerization and solution processing to obtain a high TC of approximately 0.44 W/m·K when the SWNTs filler was 65 wt% 15 .…”

The preparation and feasibility analysis of magnetic orientation method in the study of thermal insulation composite materials in the field of electronic packaging

“…In electronic packaging, the packaging area and heat dissipation area are often placed opposite with each other. Although the distance is close, the contact area is extremely large and hard to improve the vertical thermal conductivity 4–6 . From the perspective of TIMs material selection, epoxy resin (EP) has a low dielectric constant, perfect rheological properties before crosslinking, and excellent mechanical properties after curing 7–9 .…”