Design of embedded passive components in Low-Temperature Cofired Ceramic on Metal (LTCC-M) technology

Fathy, Aly E.; Pendrick, V.; Ayers, G. H.; Geller, B.D.; Narayan, Yogendra; Thaler, B.; Chen, H.D.; Liberatore, M.J.; Prokop, J.; Choi, Kwang Lim; Swaminathan, Madhavan

doi:10.1109/mwsym.1998.700608

Cited by 34 publications

(10 citation statements)

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“…Several authors have reported the use of planar and 3 dimensional spiral inductors in LTCC [4]- [8]. While this type of inductor is capable of producing a high-Q inductance, the effective inductances are usually limited to a few nanohenries and are mainly used in lower microwave frequency applications.…”

Section: A High Value Embedded Toroid Inductor Designmentioning

confidence: 99%

High Value Passive Component Integration in LTCC Technology

Hoppenjans

Chappell

2007

2007 IEEE/MTT-S International Microwave Symposium

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This paper presents the use of a unique component geometry to fabricate large valued inductors buried in an LTCC substrate. The large valued inductors presented create a self shielding buried component that require no external shields to isolate the inductor from other components in the circuit. As a demonstration of the usefulness of such a component, an example SAW filter matching circuit is discussed. The performance of the SAW filter and integrated matching circuit is also presented.

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Section: A High Value Embedded Toroid Inductor Designmentioning

confidence: 99%

High Value Passive Component Integration in LTCC Technology

Hoppenjans

Chappell

2007

2007 IEEE/MTT-S International Microwave Symposium

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“…One obvious way is to reduce the chip size hence save valuable semiconductor real estate. Utilizing the concept of multilevel circuits helps save area and reduce chip size [1]. In recent years, several multilevel monolithic microwave integrated ciruicts (MMIC's) have been reported [2], [3].…”

Section: Introductionmentioning

confidence: 99%

Properties of the embedded transmission line (ETL)-an offset stripline with two dielectrics

Darwish

Ezzeddine

Huang

et al. 1999

IEEE Microw. Guid. Wave Lett.

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In three-dimensional (3-D) circuits that employ multilevel metallization, a frequently encountered transmission line configuration is the embedded transmission line (ETL), which is essentially an offset stripline topology with two dielectrics. There is no closed-form expression available for either the characteristic impedance or effective dielectric constant, since the problem is analytically complex for an exact analysis. This letter provides an approximate empirical formula for both the effective dielectric constant and the characteristic impedance, and compares them with full-wave simulations of the structure. A few percent error (typically, less than 3% for Z o ; and 5% for " e ) is observed over a wide range of transmission line parameters.

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“…C OMPLEX microwave and millimeter (mm)-wave frontends including a number of monolithic microwave integrated circuits (MMIC's) as well as interconnect lines and hybrid components today often are realized as multichip modules (MCM's) on low-temperature cofired ceramic (LTCC) [1]- [3]. In some applications, band-pass filters are required within these front-ends [4].…”

Section: Introductionmentioning

confidence: 99%