Design of Experiment Analysis of Thermal Variables that Affect Automotive Lighting CFD Temperatures

El-Khatib, Fadi; Bielecki, Joseph W.; Poorman, Thomas

doi:10.4271/2006-01-0490

Cited by 3 publications

(1 citation statement)

References 6 publications

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“…The exposed heat sink option for LED components in automotive lamps if the design allows may be advantageous to meet design test standards, but the back of a forward lighting assembly may be exposed to an unexpected under-hood hot air temperature. [9][10] [11] …”

Section: Thermal Standards and Test Requirementsmentioning

confidence: 99%

Thermal Considerations for LED Components in an Automotive Lamp

Bielecki¹,

Jwania²,

Khatib³

et al. 2007

Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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LED's in automotive lamp applications have been utilized effectively for functions with low light output requirements and for styling purposes. In recent years, high to ultra high power LED's are becoming a light source option for virtually every automotive lighting system. For exterior automotive lighting, these light sources have distinct advantages, but also unique thermal issues compared to conventional incandescent light sources. This study describes two methods of determining the junction temperature of an LED or array of LED's, direct and indirect. Both are based on temperature measurements, but the indirect method also requires a thermal resistance specified by the manufacturer. The direct method utilizes the intrinsic behavior of the junction voltage drop at low current (<0.1mA). A computer model for a typical plate finned heat sink design for a high power LED automotive lamp was experimentally calibrated. Design of experiment analysis was performed using a 3 level 3 input factor full factorial test matrix. The factors were defined as an active heat sink surface area, convection coefficient correlated to an airflow, and environment temperature. A quadratic model is generated from the results of the factors and significant interactions to the response.

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Section: Thermal Standards and Test Requirementsmentioning

confidence: 99%