Design of micro-channel heat sink with diamond heat spreader for high power LD

Liu, Gang; Wang, Wentao; Liu, Lei; Liang, Xingbo; Wang, Chao; Chen, Sanbin; Liu, Yang; Tang, Xiaojun

doi:10.1117/12.979795

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“…Calame [2] conducted the experimental and simulation analysis on the hybrid micro-channel cooler consisting of diamond-on-Si or diamond-on-SiC, and better performances were exhibited than the Si or SiC alone. According to G. Liu's numerical calculations, a thin diamond heat spreader could enable about 10% to 20% decrease of the whole thermal resistance of the heat sink [25]. In this study, a diamond heat spreader of similar size to the chip has been utilized to enhance the hotspot cooling capability of the liquid-cooled Cu heat sink.…”

Section: ⅰ Inroductionmentioning

confidence: 99%