Design of multi-beam optics for high throughput parallel processing

Hofmann, Oskar; Stollenwerk, Jochen; Loosen, Peter

doi:10.2351/1.5125778

Cited by 27 publications

(9 citation statements)

References 18 publications

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“…Massively parallel processing could be arranged with high power USP lasers. The beam emitted by the laser is transformed into an arrangement of multiple laser beams with specific intensity distributions [68]. The main challenge in using the multi-beam optical system is the distortion of the spot-array on the workpiece.…”

Section: Multi-beam Systemsmentioning

confidence: 99%

Ultra-Short Pulse Lasers for Microfabrication: A Review

Račiukaitis

2021

IEEE J. Select. Topics Quantum Electron.

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Ultra-short pulse lasers, generating coherent light pulses with pulse durations in the picosecond and femtosecond range, are becoming popular in precision laser microfabrication. They are benefiting not only from well-predicted laser ablation with the suppressed heat-affected zone but also by opening new processing opportunities, especially in transparent materials, due to enhanced non-linear interaction with the material. In this review, the evolution of various kinds of mode-locked lasers from a scientific toy to a robust industrial tool is reviewed. The utilization benefits of high-average-power, high-pulse-repetition-rate ultra-short pulse laser are closely related to beam shaping and manipulation techniques. Fast beam scanning with galvanometric and polygon scanners as well as multi-beam parallel processing methods were developed. Some hot applications areas are briefly described. The efficient use of photons from ultra-short pulse lasers pushed the development of optimization methods in the ablation process. Efforts toward upscaling the process by increasing the average power of mode-locked lasers made feedback to laser developers, and burst regime became a necessity as well as high-speed beam scanning devices. Unique opportunities of ultra-short pulses are successfully exploited in machining transparent materials, with glass separation being the leading application.

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Section: Multi-beam Systemsmentioning

confidence: 99%

Ultra-Short Pulse Lasers for Microfabrication: A Review

Račiukaitis

2021

IEEE J. Select. Topics Quantum Electron.

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“…In such cases, parallel processing using arrayed laser beams is an effective alternative. Although a beam splitting device for this purpose has been reported 21 , it lacks flexibility because each arrayed laser beam cannot be switched independently since only one primary laser light source is used.…”

Section: Discussionmentioning

confidence: 99%

Chip-scale high-peak-power semiconductor/solid-state vertically integrated laser

Yue¹,

Tanaka²,

Hirano³

et al. 2022

Nat Commun

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Compact lasers capable of producing kilowatt class peak power are highly desirable for applications in various fields, including laser remote sensing, laser micromachining, and biomedical photonics. In this paper, we propose a high-peak-power chip-scale semiconductor/solid-state vertically integrated laser in which two cavities are optically coupled at the solid-state laser gain medium. The first cavity is for the intra-pumping of ytterbium-doped yttrium aluminum garnet (Yb:YAG) with an electrically driven indium gallium arsenide (InGaAs) quantum well, and the second cavity consists of Yb:YAG and chromium-doped yttrium aluminum garnet (Cr:YAG) for passive Q-switching. The proposed laser produces pulses as short as 450 ps, and an estimated peak power of 57.0 kW with a laser chip dimension of 1 mm3. To the best of our knowledge, this is the first monolithic integration of semiconductor and solid-state laser gain mediums to realize a compact high-peak-power laser.

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“…Using a multi-beam through such system creates a distortion of the beamlets pattern. 9 Active solutions exist but they are complicated and expensive to implement. In our case the motorized stages moving the carriages and the Titanium sheet allow to cover easily the whole sample area, and we can restrict the scan field size where the distortions are acceptable for the drilling process.…”

Section: The Machine Integrationmentioning

confidence: 99%

kW-level USP lasers for high-rate drilling of airplane structures

Biver

Vendramini²,

Pouysegur

et al. 2023

Laser-Based Micro- And Nanoprocessing XVII

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We report on the use of a kW USP (ultrashort pulse) laser system for high throughput industrial drilling, applied to the production of large micro-perforated panels, used for a new airplane drag reduction technique. In order to limit the heat accumulation due to the high power and maximize productivity, we parallelize the process: the beam is first s plit i nto s ub-beams s ent t o d ifferent pr ocessing un its, an d th en fu rther sp lit into multi-beams focused on the workpiece. Handling a kW USP laser beam makes it necessary to consider thermal regulation and potential damages. We discuss several design challenges, present results of a drilling study that illustrates how beam management strategies impact drilling quality and yields, and finally p resent t he t echnical solutions implemented within a functional industrial prototype using a kW femtosecond laser.

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Design of multi-beam optics for high throughput parallel processing

Cited by 27 publications

References 18 publications

Ultra-Short Pulse Lasers for Microfabrication: A Review

Ultra-Short Pulse Lasers for Microfabrication: A Review

Chip-scale high-peak-power semiconductor/solid-state vertically integrated laser

kW-level USP lasers for high-rate drilling of airplane structures

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