2008
DOI: 10.1109/tmag.2008.2002414
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Design of Ni Mold for Discrete Track Media

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Cited by 6 publications
(3 citation statements)
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“…A Ni stamper had line-and-space patterns with a ridge width of 30 nm, a depth of 58 nm, and pitches of 90 nm, 120 nm, 150 nm, 200 nm, and 320 nm, i.e., trench widths of 60 nm, 90 nm, 120 nm, 170 nm, and 290 nm, respectively. The shape of these patterns has been described in detail in the previous work [13]. The materials used were polycarbonate (PC, AD-5503; Teijin Chemicals Ltd.; glass transition temperature (T g ): 145 °C) and cycloolefin polymer (COP, ZENOR1060R; ZEON CORPORATION; T g : 100 °C).…”
Section: Methodsmentioning
confidence: 99%
“…A Ni stamper had line-and-space patterns with a ridge width of 30 nm, a depth of 58 nm, and pitches of 90 nm, 120 nm, 150 nm, 200 nm, and 320 nm, i.e., trench widths of 60 nm, 90 nm, 120 nm, 170 nm, and 290 nm, respectively. The shape of these patterns has been described in detail in the previous work [13]. The materials used were polycarbonate (PC, AD-5503; Teijin Chemicals Ltd.; glass transition temperature (T g ): 145 °C) and cycloolefin polymer (COP, ZENOR1060R; ZEON CORPORATION; T g : 100 °C).…”
Section: Methodsmentioning
confidence: 99%
“…Experiments xperiments xperiments xperiments Master media that were used in this experiment were made of FeCo film (Co 30 at.%, Ms = 1900 emu/cm 3 , Hc = 70 Oe, µ= 100) sputtered onto patterned Ni substrate, which was fabricated by EB lithography, sputtering and electroplating techniques 4), 5) . The thickness of the FeCo film is 0.1 µm.…”
Section: E E Ementioning
confidence: 99%
“…15) In contrast, metallic molds, especially Ni, have advantages in hardness and abrasion resistance, and thus have been investigated as alternatives to Si. 16) However, there is still a technological challenge in making extremely fine 3D Ni molds below 100 nm. The most studied fabrication process for Ni molds consists of 1) making 3D patterns on the resist film coated on the Si wafer by electron beam lithography (e-beam lithography), which works as a master mold, 2) forming a thin Ni layer on the 3D resist by electroless plating, working as a seed layer for subsequent electroplating, 3) filling the patterns by electroplating, and 4) delaminating the Ni mold from the master mold.…”
Section: Introductionmentioning
confidence: 99%