“…A summary of cost modelling methods is presented in Table 12. [27,122,123] from stored energy [23,36,48,62,63,[117][118][119][120]124] empirical equation based on capacitance [115,116] from geometry for an integrated LC module [42,43] from geometry for a planar integrated passive module [54] from geometry for a film capacitor [46] estimated from thermal resistance [23,27,33,36,62,63,125] a CSPI introduced for each heat sink, optimisation looks for higher CSPI [29,107,108,126] from price of off-the-shelf components [127][128][129] cost of passive components is approximated from value [65,66,82] cost of stranded wire estimated from strand diameter and number [39] cost of a semiconductor chip is estimated from surface area Given the difficulties of estimating economic value of a certain component or converter, all of the cost modelling approaches are only low-order approximations. Cost modelling approaches in Table 12 are application-specific and cannot be compared with each other directly.…”