A development in the area of high temperature polymers, which offers solutions to many existing packaging and reliability challenges of electronics industry, is described. Packaging, protection and reliability of various electronic devices and components that include PCB's, MEM's, optoelectronic devices, fuel cell components and nano-electronic parts are becoming more challenging due to their long-term performance requirements. Parylene HT offers solutions to many existing packaging and reliability issues of electronics industry in part because of its excellent electrical & mechanical properties, chemical inertness and long-term thermal stability at high temperature exposure to over 350°C (short-term at 450 °C). Experimental results and trial runs demonstrate the ability of Parylene HT coating to meet the growing requirements of higher dielectric capabilities, higher temperature integrity and mechanical processing etc. of dynamic electronic industry. In addition, Parylene HT polymer coating truly conforms to the parts due to its molecular level deposition characteristics. Its suitability and biocompatibilty encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries, which include enhancing high temperature application/technologies.