Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
DOI: 10.1007/0-387-32989-7_25
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Design, Process, and Reliability of Wafer Level Packaging

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Cited by 11 publications
(1 citation statement)
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“…Packaging of these devices involves technology of material, fabrication process, thermal management and optimization of layout related to various performances of the devices. Hence, the desire for more reliable components and appropriate packaging is becoming more apparent, as fewer field failures save the manufacturer money [1][2][3][4][5][6].…”
Section: Introductionmentioning
confidence: 99%
“…Packaging of these devices involves technology of material, fabrication process, thermal management and optimization of layout related to various performances of the devices. Hence, the desire for more reliable components and appropriate packaging is becoming more apparent, as fewer field failures save the manufacturer money [1][2][3][4][5][6].…”
Section: Introductionmentioning
confidence: 99%