Design Tradeoffs for Electrothermal Microgrippers

Mayyas, Mohammad; Zhang, P.; Lee, W.H.; Shiakolas, Panos S.; Popa, Dan O.

doi:10.1109/robot.2007.363101

Cited by 16 publications

(22 citation statements)

References 18 publications

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“…(1) determination of the thermal time constant of the microactuator of interest; (2) determination of the boundary layer size associated with this thermal time constant using equation (2); (3) extraction of appropriate thin film coefficients from table 3 (construction of the h function should be repeated for critical dimensions other than 10 μm); (4) application of the listed values in table 3 as boundary conditions in thermomechanical finite element simulations. Table 3.…”

Section: Methodsmentioning

confidence: 99%

On heat transfer at microscale with implications for microactuator design

Ozsun¹,

Alaca²,

Yalçınkaya³

et al. 2009

J. Micromech. Microeng.

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The dominance of conduction and the negligible effect of gravity, and hence free convection, are verified in the case of microscale heat sources surrounded by air at atmospheric pressure. A list of temperature-dependent heat transfer coefficients is provided. In contrast to previous approaches based on free convection, supplied coefficients converge with increasing temperature. Instead of creating a new external function for the definition of boundary conditions via conductive heat transfer, convective thin film coefficients already embedded in commercial finite element software are utilized under a constant heat flux condition. This facilitates direct implementation of coefficients, i.e. the list supplied in this work can directly be plugged into commercial software. Finally, the following four-step methodology is proposed for modeling: (i) determination of the thermal time constant of a specific microactuator, (ii) determination of the boundary layer size corresponding to this time constant, (iii) extraction of the appropriate heat transfer coefficients from a list provided and (iv) application of these coefficients as boundary conditions in thermomechanical finite element simulations. An experimental procedure is established for the determination of the thermal time constant, the first step of the proposed methodology. Based on conduction, the proposed method provides a physically sound solution to heat transfer issues encountered in the modeling of thermal microactuators.

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Section: Methodsmentioning

confidence: 99%

On heat transfer at microscale with implications for microactuator design

Ozsun¹,

Alaca²,

Yalçınkaya³

et al. 2009

J. Micromech. Microeng.

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show abstract

“…Mayyas et.al, (2007) has discussed the design, fabrication, packaging tradeoffs along with the trade off in the use of electro thermal MEMS devices for the microassembly applications. The several electro thermal endeffectors have been fabricated also discussed the dynamic performance and the practical challenges with the end-effectors [11].…”

Section: Related Workmentioning

confidence: 99%

Design and Analysis of Electro thermally Actuated Microgripper

Vij¹,

Singh²,

Jain³

2014

IOSRJVSP

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“…Microstructures based on an array of thermal actuators provide powerful force and wide overall deflection [9][10][11]. A class of new active end-effectors based on an E-T actuation principle was introduced in our earlier work [7,11].…”

Section: Open Accessmentioning

confidence: 99%

“…A class of new active end-effectors based on an E-T actuation principle was introduced in our earlier work [7,11]. The performance of E-T actuators is limited by the maximum operating temperature and thermal stresses [12][13][14].…”

Section: Open Accessmentioning

confidence: 99%

Comprehensive Thermal Modeling of ElectroThermoElastic Microstructures

Mayyas

2012

Actuators

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Bent and folded beam configurations have been popularly used in electrothermoelastic (E-T) actuation. This paper introduces new designs of thermal end-effector with micro-grasping and micro-heating capabilities. We obtained analytical models for all possible steady state temperature responses of suspended and overhanging microstructures that constitute bent beam, folded beam, and combined actuators. Generally, the thermal response of E-T microstructures is sensitive to the boundary conditions, particularly for high power input. Thermal models have predicted the failure due to melting, which is the most common reason for failure of E-T devices, and it often occurs in the longest and the thinnest microstructure.

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Design Tradeoffs for Electrothermal Microgrippers

Cited by 16 publications

References 18 publications

On heat transfer at microscale with implications for microactuator design

On heat transfer at microscale with implications for microactuator design

Design and Analysis of Electro thermally Actuated Microgripper

Comprehensive Thermal Modeling of ElectroThermoElastic Microstructures

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