Designs of fully on-chip antennas in (Bi)CMOS technology

Pan, Shiji; Gilreath, Leland; Heydari, Payam; Capolino, Filippo

doi:10.1109/iwat.2012.6178682

Cited by 5 publications

(3 citation statements)

References 11 publications

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“…The OCA and antennain-package (AiP) are smart technologies that provide the single-chip radio solution. These technologies allow the codesign of the antenna and the radio chip (in micro/nano CMOS technology) into the same high-sensitivity silicon substrate package, which compresses the die area of the radio system [87][88][89][90][91][92]. There is a tradeoff between antenna size and performance in terms of operating frequency, that is, the higher (lower) the frequency, the smaller (larger) the size can be.…”

Section: Discussionmentioning

confidence: 99%

Ingestible Wireless Capsule Technology: A Review of Development and Future Indication

Basar

Malek

Juni

et al. 2012

International Journal of Antennas and Propagation

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Ingestible wireless capsule endoscopy (WCE) is the one and only painless, effective, novel, diagnostic technology for inspecting the entire gastrointestinal (GI) tract for various diseases, such as obscure gastrointestinal bleeding (OGIB), tumors, cancer, Crohn’s disease, and celiac disease. Since the development of this technology, several companies have made remarkable improvements in their clinical products, but there are still some limitations that relate to the use of conventional wired endoscopy. Some of the major limitations that currently impede its wider application include its inability to repeat the view of critical areas, working time constraints, and poor image resolution. Many research groups currently are working on ways to solve these limitations. Presently, developing the ability to control the movement of the capsule, increasing its image transmission speed, and obtaining high-quality images are the main issues in the research area. A complex capsule with some therapeutic tools for the treatment of diseases of the GI tract also is at the beginning of development for the next generation of an active medical robot. In this paper, we report the status of several activities related to WCE, including improvement of capsule technology, research progress, technical challenges, and key indicators concerning the next-generation, active, medical robot.

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Section: Discussionmentioning

confidence: 99%

Ingestible Wireless Capsule Technology: A Review of Development and Future Indication

Basar

Malek

Juni

et al. 2012

International Journal of Antennas and Propagation

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“…Moreover gain and efficiency of on-chip antennas are normally lower compared to in-package versions. Examples of realized on-chip antennas include a D-band on-chip end-fire Yagi-Uda antenna with 4.7 dBi peak gain and 76 % radiation efficiency based on a 130-nm SiGe BiCMOS process [1]; an on-chip dual dipole antenna with 7 dBi gain and 60 % efficiency implemented on a SiGe BiCMOS process [2]; and a slot antenna of -2 dBi gain and 18 % efficiency by a CMOS process [3]. Besides the limited antenna gain and radiation efficiency, the considerable clean room processing cost is another barrier for mass production.…”

Section: Introductionmentioning

confidence: 99%

A -Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production

Zhang

Kärnfelt

Gulan

et al. 2016

IEEE Trans. Compon., Packag. Manufact. Technol.

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A grid array antenna working around 145 GHz is proposed in this paper. The antenna is built on Liquid Crystal Polymer (LCP) and designed for the D-band Antenna-in-Package (AiP) application. The intrinsic softness of the LCP material is a limiting factor of the antenna's aperture size. A 0.5 mm thick copper core is used to compensate. By doing this, the rigidness of the antenna is effectively improved, compared with an antenna without the copper core. Wet etching is used to realize the patterns on the top and bottom conductor. Compared with a Low Temperature Co-Fired Ceramic (LTCC) counterpart, we obtain a considerable cost reduction with acceptable performance. The proposed antenna has an impedance bandwidth of 136-157 GHz, a maximum gain of 14.5 dBi at 146 GHz and vertical beams in the broadside direction between 141-149 GHz. The fabrication procedures of the antennas are introduced and a parametric study is carried out which shows the antenna's robustness against fabrication tolerances like the not well controlled etching rate and the substrate surface roughness. This makes the antenna a promising solution for mass production.

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“…Superstrate antennas can increase radiation efficiency, however with the cost of increased complexity because of their non-planar structure and cost due to the extra assembly A , they may not be an attractive and optimal solution. Another technique to improve antenna performance is to develop high impedance surface (HIS) or artificial magnetic conductor (AMC) based broad-side on-chip antennas, which have also been reported in the literature [7][8]. But the reported measured gain is around 1 dBi or less.…”

Section: Introductionmentioning

confidence: 99%

A D-Band Micromachined End-Fire Antenna in 130-nm SiGe BiCMOS Technology

Khan

Ulusoy

Dufour

et al. 2015

IEEE Trans. Antennas Propagat.

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The design of a radiation-efficient D-band end-fire onchip antenna utilizing a localized backside etching (LBE) technique, as well as an antenna-in-package (AiP) on a low-cost organic substrate is presented. Quasi-Yagi-Uda antennas are chosen for end-fire radiation because of their compact size. The on-chip antenna is realized in the back-end of the line (BEOL) process of a 130 nm SiGe BiCMOS technology, while the inpackage antenna is realized in liquid crystal polymer technology for comparison. The on-chip antenna design is optimized to meet both process reliability specifications and radiation performance, and corresponding design guidelines are provided. The fabricated on-chip antennas show state-of-the-art performance with a peak gain of 4.7 dBi and, simulated radiation efficiency of 82%, and measured radiation efficiency of 72-76% using the Gain/Directivity and Wheeler-cap methods at 143 GHz. The antenna demonstrates a 3-dB gain bandwidth of more than 30 GHz and 10-dB impedance bandwidth greater than 20 GHz (14% impedance bandwidth). The measurements of the onpackage end-fire antenna showed very comparable results with a peak measured gain of 6 dBi and a simulated and measured radiation efficiency of 92% and 86% at 143 GHz. These results demonstrate that highly efficient on-chip end-fire antenna implementation is possible in standard commercially available BiCMOS process. Index Terms-Antenna-in-package (AiP), liquid crystal polymer (LCP), localized back-side etching, mm-waves, micromachining, on-chip antenna, SiGe BiCMOS 0018-926X (c)

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Designs of fully on-chip antennas in (Bi)CMOS technology

Cited by 5 publications

References 11 publications

Ingestible Wireless Capsule Technology: A Review of Development and Future Indication

Ingestible Wireless Capsule Technology: A Review of Development and Future Indication

A -Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production

A D-Band Micromachined End-Fire Antenna in 130-nm SiGe BiCMOS Technology

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