2016
DOI: 10.1016/j.apsusc.2016.03.039
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Detailed analysis of surface asperity deformation mechanism in diffusion bonding of steel hollow structural components

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Cited by 36 publications
(5 citation statements)
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“…According to the results in 3.2, three parameters of holding time, holding pressure, and bonding temperature could affect the shear bond strength of the joints. During holding at a certain pressure, the creep/superplasticity induced and accelerated grain boundary migration [26]. In these experiments, there were voids along grain boundaries when the holding time was short (Fig.…”
Section: Analysis Of Technological Parameters During the Diffusion Bonding Processmentioning
confidence: 76%
“…According to the results in 3.2, three parameters of holding time, holding pressure, and bonding temperature could affect the shear bond strength of the joints. During holding at a certain pressure, the creep/superplasticity induced and accelerated grain boundary migration [26]. In these experiments, there were voids along grain boundaries when the holding time was short (Fig.…”
Section: Analysis Of Technological Parameters During the Diffusion Bonding Processmentioning
confidence: 76%
“…The formation of new grain boundaries indicates the occurrence of metallurgical bonds in the original interface region. In contrast, the concave areas of the interface become voids because of insufficient contact [30]. When the strain is low, as shown in figure 5(a), residual round voids and straight interfaces typically form after deformation.…”
Section: Discussionmentioning
confidence: 99%
“…It is widely used in aerospace, ships, vehicles, petrochemical industry, construction medical devices, and other felds. Because of its light weight, high strength, high stifness, and low consumption, it is used to meet the development trend and requirements of lightweight, high performance, and complexity of industrial components [1,2].…”
Section: Introductionmentioning
confidence: 99%