Detailed Evolution Mechanism of Interfacial Void Morphology in Diffusion Bonding

Zhang, Chao; Li, Hong; Li, Miaoquan

doi:10.1016/j.jmst.2015.12.002

Cited by 45 publications

(3 citation statements)

References 28 publications

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“…The results show that it is difficult for 1420-1420 couple to obtain sound joints without interfacial voids under the present bonding parameters. This is similar to the results of former study [ 21 ], who concluded that it is difficult to produce a joint with 100% metallurgical bond area. Compared with the 7B04-7B04 bond couple, there is no obvious grain growth in the 1420-1420 bond couple.…”

Section: Resultssupporting

confidence: 92%

Effect of Alloying Elements Gradient on Solid-State Diffusion Bonding between Aerospace Aluminum Alloys

Zhou

Han

et al. 2018

Materials

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Three different bonding couples assembled by two commonly used aerospace aluminum alloys were bonded within the temperature range of 460–520 °C under 6 MPa for 60 min in vacuum atmosphere. The interface microstructure and alloying elements distribution of the bonded joints were determined by scanning electron microscope (SEM) and Energy Dispersive Spectroscope (EDS); the bond strength was evaluated by tensile-shear strength test. The results show the bond quality improved effectively as the bonding temperature increased. Compared with the 1420-1420 and 7B04-7B04 bonding couples, the 1420-7B04 couples obtained better interface integrity and higher bond strength, the highest shear strength for 1420-7B04 couple can be as high as 188 MPa when bonded at 520 °C. Special attention was focused on the 1420-7B04 couple, the diffusion coefficient of Mg at the original interface under different temperatures were investigated, the results show the diffusion coefficient increased obviously as the bonding temperature increased. A diffusion affected zone (DAZ) without continuous intermetallic phases formed due to the diffusion of alloying elements across the bonding interface. The combined action of temperature and alloying elements gradient resulted in the increase of alloying elements diffusion fluxes, which in turn promote the bonding quality through the accelerated shrinkage of interfacial voids.

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Section: Resultssupporting

confidence: 92%

Effect of Alloying Elements Gradient on Solid-State Diffusion Bonding between Aerospace Aluminum Alloys

Zhou

Han

et al. 2018

Materials

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“…Based on the solid state bonding process, many advanced techniques have been successfully applied in the joining of metal, such as friction stir welding (FSW) [6], accumulative roll bonding (ARB) [7], and diffusion bonding (DB) [8]. Although these techniques rely on different mechanisms, the critical process to achieve a good bonding quality is the elimination of the initial bonding line at the interface.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding

Ren

Chen

et al. 2021

Processes

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In this study, a plastic deformation process consisting of hot compression at 350 °C and heat treatment at 400 °C was performed to bond AZ31 magnesium alloy. Microstructural evolution around the bonding interface was systematically characterized to investigate the bonding process and clarify the bonding mechanism. When the plastic deformation strain reached 0.6, the bonding zone was full of fine dynamic recrystallized grains and the initial interface was eliminated. The post-heating treatments were conducted to achieve a sound interface bonding. The tensile tests and the corresponding fracture morphologies analysis indicated that the optimum holding time of heat treatment was 8 h. The interfacial bonding strength of the specimens holding for 8 h reached 164.7 MPa, an enhancement of about 9% compared with that of the specimens holding for 1 h. The microstructure analysis indicated that the bonding quality was affected by migration of the interfacial grain boundary (GB), the development of recrystallized grains and the evolution of interfacial oxides around the bonding area.

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“…For the reasons described above, it is essential to control the deformation during the diffusion bonding of microprocessor devices. Surprisingly, there is not too much literature facing deformation on the microscopic and macroscopic scale during diffusion bonding [3][4][5]. Moravec et al give a set of parameters including the deformation using a thermomechanical simulator Gleeble 3500-device (Poestenkill, NY, USA) [6].…”

Section: Introductionmentioning

confidence: 99%

Comprehensive Study of the Deformation Behavior during Diffusion Bonding of 1.4301 (AISI 304) as a Function of Material Width and Aspect Ratio

Gietzelt¹,

Toth²,

Kraut³

et al. 2020

Metals

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In this paper, the impact of material width as well as aspect ratio on deformation during diffusion bonding of layered samples were investigated. For this, six annular samples with a constant cross-sectional area but an increasing diameter and thus decreasing material width were designed. In a first set of experiments, specimens of a constant height of h = 20 mm were examined. Each sample consisted of 10 sheets, 2 mm in thickness each. Diffusion bonding was performed at T = 1075 °C, t = 4 h and p = 15 MPa. Subsequently, additional samples with a constant aspect ratio of about three but different material width were diffusion bonded. For this, additional layers were added. It was expected that the deformation should be nearly constant for a constant aspect ratio. However, comparing the deformation to a sample possessing an aspect ratio of about three from the first batch, a much higher deformation was obtained now. Bonding a third sample, a deformation in the same range as for the other two samples of the second batch was obtained. It was found that due to the evaporation of metals, the thermocouples were subjected to aging, which was proven indirectly by the evaluation of heating power. Since the diffusion coefficient of the metals follows an exponential law, deformation changes considerably with temperature. This emphasizes that exact temperature measurement is very important, especially for bonding microprocessor devices at constant contact pressure. The experiments showed that the deformation depends strongly on geometry. Bonding parameters cannot be generalized. For layered setups, the contribution that thickness tolerances from manufacturing and leveling of surface roughnesses of sheets add to the overall deformation cannot be reliably separated. After diffusion bonding, thickness tolerances increase with a lateral dimension. Obviously, the stiffness of the pressure dies is crucial.

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Detailed Evolution Mechanism of Interfacial Void Morphology in Diffusion Bonding

Cited by 45 publications

References 28 publications

Effect of Alloying Elements Gradient on Solid-State Diffusion Bonding between Aerospace Aluminum Alloys

Effect of Alloying Elements Gradient on Solid-State Diffusion Bonding between Aerospace Aluminum Alloys

Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding

Comprehensive Study of the Deformation Behavior during Diffusion Bonding of 1.4301 (AISI 304) as a Function of Material Width and Aspect Ratio

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