2018
DOI: 10.2478/mape-2018-0004
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Detection and Recording of Acoustic Emission in Discrete IGBT Transistors

Abstract: The article presents the results of experimental research, which is to show a correlation between the change of operating status of single IGBT transistor and its acoustic emission. Sensor signal was obtained with oscilloscope in order to further process it digitally and determine possibility of the damage to the element based on registered acoustic signal.

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Cited by 3 publications
(1 citation statement)
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“…The most popular areas of application are the supervision of fatigue phenomena and cracks in steel structures [ 1 , 2 , 3 , 4 ], rolling elements in bearings [ 5 , 6 ] or the occurrence of partial discharges in power transformers [ 7 , 8 ] and medium voltage switchgears [ 9 , 10 , 11 ]. There have been attempts at recognizing AE signals in low voltage insulated gate bipolar transistors (IGBTs) [ 12 , 13 , 14 , 15 , 16 ] even with changes of junction and case temperature [ 17 ]. It must be noted that AE tests were applied to small packaging low-voltage semiconductors (without electrical insulation inserted between AE sensor and device case) but it can be assumed that the propagation of elastic waves in much bigger structures will behave differently because of the extended internal volume of different types of packaging and the use of insulating inserts for medium-voltage operation.…”
Section: Introduction To the Subject Mattermentioning
confidence: 99%
“…The most popular areas of application are the supervision of fatigue phenomena and cracks in steel structures [ 1 , 2 , 3 , 4 ], rolling elements in bearings [ 5 , 6 ] or the occurrence of partial discharges in power transformers [ 7 , 8 ] and medium voltage switchgears [ 9 , 10 , 11 ]. There have been attempts at recognizing AE signals in low voltage insulated gate bipolar transistors (IGBTs) [ 12 , 13 , 14 , 15 , 16 ] even with changes of junction and case temperature [ 17 ]. It must be noted that AE tests were applied to small packaging low-voltage semiconductors (without electrical insulation inserted between AE sensor and device case) but it can be assumed that the propagation of elastic waves in much bigger structures will behave differently because of the extended internal volume of different types of packaging and the use of insulating inserts for medium-voltage operation.…”
Section: Introduction To the Subject Mattermentioning
confidence: 99%