Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat
DOI: 10.1109/ipfa.2001.941474
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Determination of BGA structural defects and solder joint defects by 3D X-ray laminography

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Cited by 12 publications
(2 citation statements)
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“…s(x, y) = σ xy + c 3 σ x σ y + c 3 (16) l(x,y) is the brightness component, c(x,y) is a contrast component, s(x,y) is the structural component. µ x and µ y represent the means of x, y, σ x and σ y represent the standard deviation of x, y, respectively.…”
Section: Reconstruction Quality Assessmentmentioning
confidence: 99%
“…s(x, y) = σ xy + c 3 σ x σ y + c 3 (16) l(x,y) is the brightness component, c(x,y) is a contrast component, s(x,y) is the structural component. µ x and µ y represent the means of x, y, σ x and σ y represent the standard deviation of x, y, respectively.…”
Section: Reconstruction Quality Assessmentmentioning
confidence: 99%
“…X-ray tomography has been a typical technology in the non-destructive testing area. Detailed studies of classical tomography development can be found elsewhere [17][18][19][20][21][22]. Over the past half century, with further developments in electronics and computers, X-ray computed tomography (CT) achieved rapid development.…”
Section: Introductionmentioning
confidence: 99%