Determination of junction temperature and thermal resistance in the GaN‐based LEDs using direct temperature measurement

Hwang, Woong Joon; Lee, Tae Hee; Kim, Lan; Shin, Moo Whan

doi:10.1002/pssc.200405098

Cited by 25 publications

(15 citation statements)

References 1 publication

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“…There are some investigations in which the junction temperature of LEDs and/or laser diodes is estimated using micro-Raman spectroscopy [2,[5][6][7]10], temperature coefficient of diode-forward voltage (V f ) [13,14], infrared imaging [9], electroluminescence [12], thermal resistance [8], and nematic liquid crystal thermographic technique [4]. However, the junction temperature of each chip on a LED package for illumination application, in which there are many chips electrically connected in series/parallel, is hardly obtained by V f method where total current and total voltage are measured.…”

Section: Introductionmentioning

confidence: 99%

Development of junction temperature estimation system for light-emitting LED using pulsed-laser Raman scattering

et al. 2015

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A new method by using a pulsed-laser Raman scattering technique was employed to estimate junction temperature of a fluorescence-resin-less blue-LED package. Temperature dependent Raman shift of E 2 H mode of GaN layer in the blue-LED were obtained and were in good agreement with the experimental data published by the other researchers. This technique was applied to estimation of a junction temperature of the light-emitting blue-LED. The junction temperature was successfully estimated even under the strong stray light and LED light emission. It is considered that the proposed technique would be a remote and standard system for measuring the junction temperature of light-emitting white-LEDs.

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Section: Introductionmentioning

confidence: 99%

Development of junction temperature estimation system for light-emitting LED using pulsed-laser Raman scattering

et al. 2015

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“…If the junction temperature increases, the case temperature will increase accordingly. Junction temperature can be obtained by the following equation [35]:…”

Section: Resultsmentioning

confidence: 99%

Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

2013

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This paper presents a thermal analysis and experimental validation of natural convective heat transfer of a high-brightness light-emitting diode (LED) package assembly. The substrate materials used in the LED package assembly were filled and doped using boron nitride (BN) filler. The thermal conductivity of the BN-filled substrate was measured. The temperature distribution and heat flow of the LED package were assessed by thermal profile measurement using an infrared (IR) camera and thermocouples. In addition, the heat transfer process of the LED package assembly in natural convection was also simulated using the computational fluid dynamics method. The optical performance of the LED package was monitored and investigated with various filler contents. The heat conduction mechanism in the substrate was analyzed. IR thermogram showed that the BN-doped substrate could effectively lower the surface temperature of the LED package by 21.5°C compared with the traditional FR4 substrate. According to the IESNA LM 80 lifetime testing method, reduction in LED temperature can prolong the LED's lifetime by 19,000 h. The optical performance of the LED package assembly was also found to be improved significantly in lighting power by 10%. As a result, the overall heat dissipation capability of the LED package to the surrounding is enhanced, which improves the LED's efficacy.

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“…Without an effective dissipation of heat, the light emitting efficiency of LED will be reduced, and if sufficiently hot, the LED component may even be destroyed. Removing heat from LED components is the most significant challenge in LED lighting technology (Park et al, 2004) (Hwang et al, 2004). …”

Section: Heat Dissipation Requirement Of Ledsmentioning

confidence: 99%

Thermal Performance of an Indoor Oblong LED Lighting Prototype Incorporating Heat Pipes

Lai

Chiang

2009

Journal of Asian Architecture and Building Engineering

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An innovative indoor LED lighting prototype that uses pressed-flat grooved heat pipes as heat transfer channels to conduct LED-released heat to heat-sink-fins is proposed. Natural convection inside the flow channels within the heat-sink fins serves as the main heat dissipation mechanism. In order to accommodate different illumination directions, the thermal performance of the LED lighting prototype at different inclination and rotation angles (different heat pipe performances) were experimentally investigated. The results show that the temperature distribution of the prototypes is dependent on inclination angles, however, independent of rotation angles. FFT analysis reveals that dominant fluctuation frequencies of the temperature around the central area of the prototype with different inclination angles are about 4.7 minutes.

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Determination of junction temperature and thermal resistance in the GaN‐based LEDs using direct temperature measurement

Cited by 25 publications

References 1 publication

Development of junction temperature estimation system for light-emitting LED using pulsed-laser Raman scattering

Development of junction temperature estimation system for light-emitting LED using pulsed-laser Raman scattering

Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

Thermal Performance of an Indoor Oblong LED Lighting Prototype Incorporating Heat Pipes

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