We examine the reported interface-based processes used in the modulation of Schottky barrier heights at the nickel germanide/n-type germanium and palladium germanide/ntype germanium junctions. Various sample preparation and characterization methods are discussed. Stable Ni/Ge and Pd/Ge structural phases are identified, and their temperature range of stability is established. Current-voltage (I-V) and capacitance-voltage (C-V) characteristics are analyzed to study the effect of various interface control processes. Sheet resistivity and its stability over various annealing temperature ranges are analyzed. The fundamental mechanisms at play in order to achieve ohmic characteristics are observed and analyzed using various interface control processes. Some interfacial and structural factors that pin the Fermi level are analyzed in relation to experimental results. The different interfacial control processes are analyzed, and their effectiveness is compared. Recommendations are made for the improvement of Ni and Pd contacts in the next generation of n-type germanium-based nanoelectronic devices.