2007
DOI: 10.1016/j.microrel.2007.02.007
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Determination of transistor infant failure probability in InGaP/GaAs heterojunction bipolar technology

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Cited by 4 publications
(3 citation statements)
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“…It is also possible that such a net localized charge at the dislocation will facilitate the sticking of polar molecules floating in the air or outgassed from substrate containers. A process such as this could provide an explanation of the correlation of the infant mortality of HBTs and dislocation density in the substrates, as reported by Alt et al [1]. This would imply that resolution of this important problem would be improving the substrate cleaning, not the lowering of dislocation density in the substrate.…”
Section: Discussion Of the Results And Proposed Modelmentioning
confidence: 74%
See 1 more Smart Citation
“…It is also possible that such a net localized charge at the dislocation will facilitate the sticking of polar molecules floating in the air or outgassed from substrate containers. A process such as this could provide an explanation of the correlation of the infant mortality of HBTs and dislocation density in the substrates, as reported by Alt et al [1]. This would imply that resolution of this important problem would be improving the substrate cleaning, not the lowering of dislocation density in the substrate.…”
Section: Discussion Of the Results And Proposed Modelmentioning
confidence: 74%
“…These issues have frequently been attributed to problems related to device processing. However, recently statistical evidence was presented attributing the so-called infant mortality of InGaP/GaAs Heterojunction Bipolar Transistors (HBTs) to the detrimental effects of dislocations, which are present in GaAs substrates and propagate through the epitaxial layer [1]. In this work we present results pointing to another, so far not considered type of defect in epitaxial heterostructures, which can severely degrade the performance of devices relying on vertical transport.…”
Section: Introductionmentioning
confidence: 84%
“…The general approach consists of modeling the problem as a mix of two probabilistic distributions corresponding to early and other failures (Barnett et al , 2003; Chan and Meeker, 1999; Dong and Nassif, 2018; Huang et al , 2010; Xin et al , 2005). Some practical applications are also found within electrical engineering, as reported by Alt et al (2007), Bouanaka and Healy (1988), He et al (2016) and Kuehl (2002).…”
Section: Literature Reviewmentioning
confidence: 91%