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Techniques for passivating In0.53Ga0.47As, InGaAsP, InP, and InGaAsP/InP p-n junction structures with polyimide have been developed. Low stable leakage current is maintained for prolonged bias, even after exposure to high temperatures (∼320 °C) during packaging. 150-μm-diam In0.53Ga0.47As photodiodes with a breakdown voltage of ∼50 V were passivated with polyimide and were found to consistently have leakage currents of ∼10 nA at a 20-V bias.Details of the passivation process are given.

Vapor-phase epitaxial growth of In0.53Ga0.47As lattice matched to (100) -oriented InP substrates is described, and the performance of photodiodes fabricated from this material is presented. Gas-flow conditions for lattice-matched growth with various Ga-CHl flows were established for growth using the hydride process. The effect of substrate temperature on gas-flow ratios necessary for lattice-matched growth was studied over the temperature range 650–750 °C. Growth rates were found to vary from about 8 to about 60 μm/h over this temperature range. The activation energy of surface reaction was determined to be 44 kcal/mole. Photodiodes fabricated from an InP/In0.53Ga0.47As/InP structure showed rise and fall times of ≲1 nsec with quantum efficiencies in excess of 95% at 1.22 μm.

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