Developable bottom antireflective coatings for 248-nm and 193-nm lithography

Katayama, Tomohide; Motobayashi, Hisashi; Kang, Wenbing; Toukhy, Medhat A.; Oberlander, Joseph E.; Ding, Shuji; Neisser, Mark

doi:10.1117/12.537539

Cited by 4 publications

(4 citation statements)

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“…Among these technologies is the use of DBARCs for implant layer applications beyond the 65-nm node (1). Traditionally, for implant layers a dyed photoresist was paired with a top anti-reflective coating (TARC).…”

Section: Introductionmentioning

confidence: 99%

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Comparative Study of Photosensitive Versus Non-Photosensitive Developer-Soluble Bottom Anti-Reflective Coating Systems

Lowes¹,

Stroud²,

Guerrero³

et al. 2010

ECS Trans.

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Developer-soluble bottom anti-reflective coatings (DBARCs) were originally designed for use in implant lithography processes. Throughout the development cycle, two main DBARC platforms emerged, nonphotosensitive DBARC (non-PS DBARC) and photosensitive DBARC (PS DBARC). While both platforms have been able to achieve acceptable performance for implant processes, each has advantages and disadvantages. The characteristics of each system are used to recommend a platform for use in various implant processes. DBARC processes are now being compared to single-layer resist and dry BARC processes due to additional applications such as wet-etch layers for high-k dielectric metal gate (HKMG). Integrating a new technology into production is complicated. Therefore, for each of these new applications, the different DBARC platforms have been reviewed to compare performance. The analysis allows us to recommend a DBARC and a favorable process for each application, thereby decreasing development time and cost.

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Section: Introductionmentioning

confidence: 99%

“…As the integrated circuit (IC) industry evolves, new technologies are developed to solve technical issues. Among these technologies is the use of DBARCs for implant layer applications beyond the 65-nm node (1). Traditionally, for implant layers a dyed photoresist was paired with a top anti-reflective coating (TARC).…”

Section: Introductionmentioning

confidence: 99%

Comparative Study of Photosensitive Versus Non-Photosensitive Developer-Soluble Bottom Anti-Reflective Coating Systems

Lowes¹,

Stroud²,

Guerrero³

et al. 2010

ECS Trans.

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“…Developer-soluble BARCs (DBARCs) are different than traditional dry-etch BARCs in that DBARCs are patterned with the resist during the develop step (1,3). The original application for DBARCs was to enhance the patterning of implant layers (3,4,5). These initial DBARCs developed isotropically and were adjustable by process modifications (6).…”

Section: Introductionmentioning

confidence: 99%

Use of DBARCs Beyond Implant

Washburn

Lowes²,

Guerrero³

2011

ECS Trans.

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Almost a decade ago, the integrated circuit (IC) industry realized that traditional implant layers required new technology to achieve the specifications of the shrinking design rules and increased topography effects. In response, developer-soluble bottom antireflective coatings (DBARCs) were introduced as a solution. DBARCs offered the resolution and critical dimension (CD) control needed for the increasingly critical implant layers.In this paper the benefits DBARCs can bring to other lithographic processes are reviewed. Back-end-of-line (BEOL) dual damascene processes are surveyed. Front-end-of-line (FEOL) processes are examined, including high-k metal gate (HKMG), double patterning, and spacer. All processes are defined, and the value that a DBARC brings to each process is examined, along with potential challenges.

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“…Photosensitive DBARCs have photoimageable properties and resolve patterns irrespective of upper resist layer [9][10][11][12][13][14][15][16][17][18]. Therefore, they have better resolution and through-pitch performance which are required for logic devices and critical layers.…”

mentioning

confidence: 99%