Developed passive components of planar optical schemes

Svistunov, D. V.

doi:10.1117/12.178894

Cited by 2 publications

(3 citation statements)

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“…Fig. 10 presents the calculated, on the basis of modal equations (5), relations between the cut-off value of modes TE0 and TM0 of the wave =677nm and the refractive index of the cover n from the interval (1.... 1.5). The calculations imply that the dynamics of the changes of cut-off value is higher in this case for mode TM0.…”

Section: Light Propagation In Gradient Tapered Waveguidementioning

confidence: 99%

<title>Potentials of planar gradient tapered waveguide in sensor-related applications</title>

Rogoziński

2001

SPIE Proceedings

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Section: Light Propagation In Gradient Tapered Waveguidementioning

confidence: 99%

<title>Potentials of planar gradient tapered waveguide in sensor-related applications</title>

Rogoziński

2001

SPIE Proceedings

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“…Perpendicular, or through-wafer, interconnects route light through the silicon substrate, a desirable trait for the implementation of multi-chip modules (MCM's) [13], [14]. Integrated diffraction and refraction gratings can be combined with parallel and through-wafer interconnects to form planar folded optical systems [15], [16]. The structures used to create both waveguides and through-wafer interconnects can be fabricated after the devices, allowing the bulk fabrication processes of the circuitry on the chip to remain unchanged.…”

Section: Optical Interconnect Technologiesmentioning

confidence: 99%

“…16 shows Geometry B with the smaller comb split.Figure 3.17 illustrates the comb drive with reinforced dimpled fingers (Geometry C), with a close up in Figure 3.18. They are located to the far left in Figure 3.13 and have flexure lengths of 500 & 550 µm.…”

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Through-wafer interrogation of MEMS device motion

Dawson¹

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Microelectromechanical systems (MEMS) have been the focus of many research groups because of their wide variety of uses in sensing and actuation applications. A fundamental barrier facing designers of next generation MEMS is the inability to access accurate, real-time microstructure positional information to determine if the device is performing as expected. Previously explored optical and electrical methods of MEMS device monitoring are often only suitable for research environments, or are unable to produce clear and meaningful characterization of device motion. The most desirable MEMS monitoring method would be one that could be implemented at the device level, which would allow the monitoring system to be fabricated along with the device itself. This research explores a through-wafer method of optically monitoring and characterizing the motion of a lateral comb resonator fabricated using the MultiUser MEMS Process Service (MUMPS). Positional monitoring results obtained from a 1.3 µm wavelength through-wafer optical probe are presented, as well as a method of device level implementation of the monitoring system.

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Developed passive components of planar optical schemes

Cited by 2 publications

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<title>Potentials of planar gradient tapered waveguide in sensor-related applications</title>

<title>Potentials of planar gradient tapered waveguide in sensor-related applications</title>

Through-wafer interrogation of MEMS device motion

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