Developing process for coating copper particles with silver by electroless plating method

Hai, Hoang Tri; Ahn, Jong Gwan; Kim, D.J.; Lee, Jaeryeong; Chung, Hun Saeng; Kim, C.O.

doi:10.1016/j.surfcoat.2006.03.025

Cited by 90 publications

(25 citation statements)

References 2 publications

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“…For example, Eom et al prepared a hybrid paste containing both solder powder and Cu particles as a filler material for chip bonding and confirmed the processability and superior thermal conductivity of the cured paste [11]. To enhance both the processability and the electrical and thermal properties by suppressing the oxidation of pure Cu particles, Cu particles should be replaced with Ag-coated Cu (Cu@Ag) particles [12][13][14][15][16][17]. In addition, if tiny Cu@Ag particles can be added in the vacant spaces between microscale solder and Cu@ Ag particles, the thermal and electrical conductivity of the cured paste can be enhanced with only a slight increase in the initial viscosity of the paste [18].…”

Section: Introductionmentioning

confidence: 99%

Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses

Choi

Lee

2017

Archives of Metallurgy and Materials

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For application as a low-cost conductive filler material, submicroscale Cu@Ag particles were fabricated at room temperature without any reductants by a multi-step addition method using an ethylene glycol-based Ag plating solution. Scanning electron microscopy images of the Ag-coated Cu particles demonstrated the formation of discrete Ag particles less than 100 nm in size as well as a thin Ag coating on Cu particles, during the early addition steps. However, as the thickness of the Ag coating increased, the small Ag particles agglomerated into Ag coatings with an increase in the number of Ag plating steps. Owing to the absence of additives such as surfactants, a comparison between the microstructural images and calculations indicated increased agglomeration between fabricated Ag-coated Cu particles with an increase in the number of Ag plating steps. However, thermogravimetric-differential scanning calorimetry of the agglomerated Ag-coated Cu particles after the fifth addition of the Ag plating solution demonstrated their antioxidation behavior even after 70 min in air at 150°C.

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Section: Introductionmentioning

confidence: 99%

Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses

Choi

Lee

2017

Archives of Metallurgy and Materials

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“…[1][2][3][4][5][6][7][8][9][10] The reason for this is that if an Ag coating layer can prevent the Cu oxidizing during curing in air at temperatures less than 200 C, then the Ag-coated Cu particles can be used as a more price competitive alternative to Ag ller materials currently used in the preparation of conductive pastes; i.e., the electrical conductivity of Cu is comparable to that of Ag. Furthermore, this should make it possible to reduce the size of the ller particles to around one micrometer or less, thereby keeping up with the trend in electrode printing toward producing ne patterns with dimensions narrower than the present level of 40-50 μm.…”

Section: Introductionmentioning

confidence: 99%

Resistance to Oxidation at 150℃ of Sub-Micrometer Diameter Silver-Coated Copper Particles Produced by Wet Chemical Synthesis and Immersion Plating

Shin

Lee

2017

Mater. Trans.

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Sub-micrometer diameter Cu particles fabricated in air by wet synthesis at 80 C for 2 h were immersion plated with Ag to produce an inexpensive conductive paste ller aimed at achieving ne printed patterns. Increasing the volume ratio of hydrazine hydrate to ammonium hydroxide used during wet synthesis was found to accelerate the rate of reduction and increase the yield of Cu particles to as much as 97.56% when an optimal ratio of 3:7 was used. The resulting particles (average size = 0.56 μm) exhibited excellent dispersion, with the use of an optimal Ag concentration of 15 mass% in their subsequent immersion plating producing a continuous Ag shell and a 0.62 μm average diameter. Increasing the Ag concentration beyond this, however, resulted in abrupt agglomeration between the particles, as well as the formation of cavities and spherical pure Ag particles. Those particles produced under optimal conditions experienced only a slight weight increase of 0.4% after 75 min exposure to air at 150 C, suggesting that they have an excellent resistance to oxidation at this temperature.

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“…The low electrical resistivity and excellent resistance to oxidation of Ag particles relative to other metals has seen them extensively used as a filler material in various conductive pastes [1][2][3][4][5], but the high price of Ag has continued to be significant impediment to their industrial application in electronic materials. This has led to Cu being considered as an alternative to Ag, as it offers a similar resistivity but at a much lower cost; however, even at room temperature (RT) pure Cu is vulnerable to surface oxidation in air, and the severity of this oxidation only gets worse with increasing temperature [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Ethylene glycol-based Ag plating for the wet chemical fabrication of one micrometer Cu/Ag core/shell particles

Choi

Lee

2015

Journal of Alloys and Compounds

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Developing process for coating copper particles with silver by electroless plating method

Cited by 90 publications

References 2 publications

Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses

Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses

Resistance to Oxidation at 150℃ of Sub-Micrometer Diameter Silver-Coated Copper Particles Produced by Wet Chemical Synthesis and Immersion Plating

Ethylene glycol-based Ag plating for the wet chemical fabrication of one micrometer Cu/Ag core/shell particles

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