Ethylene glycol-based Ag plating for the wet chemical fabrication of one micrometer Cu/Ag core/shell particles

Choi, Eun Byul; Lee, Jong‐Hyun

doi:10.1016/j.jallcom.2014.11.111

Cited by 10 publications

(4 citation statements)

References 14 publications

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“…Powders of active metals have been actively applied in many fields, being used as catalysts, conductive coatings and electrodes, to name just a few. However, when exposed to high temperature and/or humid environment, they are known to show poor oxidation resistance [ 1 , 2 , 3 , 4 ]. Extensive investigations have been made to improve the resistance of such nanopowders without compromising their functionalities, the most efficient strategies found being the introduction of additives (e.g., Ag [ 1 , 2 ], Cu [ 3 ], and ZrO 2 [ 4 ]) or the formation of a protective carbon layer [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

“…However, when exposed to high temperature and/or humid environment, they are known to show poor oxidation resistance [ 1 , 2 , 3 , 4 ]. Extensive investigations have been made to improve the resistance of such nanopowders without compromising their functionalities, the most efficient strategies found being the introduction of additives (e.g., Ag [ 1 , 2 ], Cu [ 3 ], and ZrO 2 [ 4 ]) or the formation of a protective carbon layer [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 ]. So far, many techniques have been developed to coat a carbon layer over metal nanoparticles, such as arc discharge [ 5 , 6 ], magnetron sputtering [ 7 ], hydrothermal carbonization [ 8 ], detonation [ 9 ], chemical vapor deposition [ 10 , 11 ], spray pyrolysis [ 12 ], and pyrolysis of organometallic compounds [ 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

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Spheroidization of Nickel Powder and Coating with Carbon Layer through Laser Heating

Shao

Cui

et al. 2018

Materials

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We developed a simple and efficient process, laser heating of nickel powder in ethanol, to produce carbon-encapsulated nickel microspheres. Long-pulse-width laser heated nickel powder suspended in pure ethanol into liquid droplets. In turn, the latter droplets became sphere-like, pyrolyzed surrounding ethanol and dissolved the produced carbon atoms. Because of their lower solubility in solid nickel, excess carbon atoms were then expelled from the metal core after solidification, thus forming graphite-like shells on the laser-modified Ni spheres. Hence, after pyrolysis the transformation of carbon was found to follow the dissolution-precipitation mechanism. The produced carbon-encapsulated nickel microspheres exhibited higher oxidation resistance compared with the initial nickel powder, while keeping their magnetic properties essentially unchanged.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Spheroidization of Nickel Powder and Coating with Carbon Layer through Laser Heating

Shao

Cui

et al. 2018

Materials

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“…For example, Eom et al prepared a hybrid paste containing both solder powder and Cu particles as a filler material for chip bonding and confirmed the processability and superior thermal conductivity of the cured paste [11]. To enhance both the processability and the electrical and thermal properties by suppressing the oxidation of pure Cu particles, Cu particles should be replaced with Ag-coated Cu (Cu@Ag) particles [12][13][14][15][16][17]. In addition, if tiny Cu@Ag particles can be added in the vacant spaces between microscale solder and Cu@ Ag particles, the thermal and electrical conductivity of the cured paste can be enhanced with only a slight increase in the initial viscosity of the paste [18].…”

Section: Introductionmentioning

confidence: 99%

Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses

Choi

Lee

2017

Archives of Metallurgy and Materials

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For application as a low-cost conductive filler material, submicroscale Cu@Ag particles were fabricated at room temperature without any reductants by a multi-step addition method using an ethylene glycol-based Ag plating solution. Scanning electron microscopy images of the Ag-coated Cu particles demonstrated the formation of discrete Ag particles less than 100 nm in size as well as a thin Ag coating on Cu particles, during the early addition steps. However, as the thickness of the Ag coating increased, the small Ag particles agglomerated into Ag coatings with an increase in the number of Ag plating steps. Owing to the absence of additives such as surfactants, a comparison between the microstructural images and calculations indicated increased agglomeration between fabricated Ag-coated Cu particles with an increase in the number of Ag plating steps. However, thermogravimetric-differential scanning calorimetry of the agglomerated Ag-coated Cu particles after the fifth addition of the Ag plating solution demonstrated their antioxidation behavior even after 70 min in air at 150°C.

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“…Ag electrodes are replaced with Cu or Ni plating on the solar cell surface (Lennon et al 2013 ). For most common conductive applications in electronic devices, Ag/Cu shell/core hybrid particle-based conductive paste is used to reduce costs (Choi and Lee 2015 ).…”

Section: Introductionmentioning

confidence: 99%

Novel Ag/Si composite particles through galvanic displacement and its conductive application

Yang

Liu

et al. 2016

SpringerPlus

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Here we synthesized a novel Ag/Si composite sub-micro particle using galvanic displacement by capitalizing on the active chemical surface of Si particles sludge from wafer-slicing process. Si works as chemical reactant, as well as reaction site to form composite particles. Sequent structural characterizations and analysis which include X-ray diffraction, transmission electron microscopy, scanning electron microscope, energy dispersive X-ray and electrical properties of this composite particle were done. A well-proved hetero-epitaxial growth mechanism could explain Ag nano-island/layer with a satisfactory bond property deposited on the Si surface. Since these Si are mechanically cleaved from crystal, formed conductive Ag/Si composites retain the flake shape from Si sludge particles, and narrow size distribution. They are preferred as conductive fillers, an Ag/Si composite-based conductive ink was prepared, its conductance was tested through screen printing, film thickness and resistivity were measured. The resistivity reached the µΩ cm level, even without optimizing the ink formulation. Our methods not only convert this Si sludge into highly conductive composite particles as filler for applications, but also considerably reduce the consumption of precious metal.

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Ethylene glycol-based Ag plating for the wet chemical fabrication of one micrometer Cu/Ag core/shell particles

Cited by 10 publications

References 14 publications

Spheroidization of Nickel Powder and Coating with Carbon Layer through Laser Heating

Spheroidization of Nickel Powder and Coating with Carbon Layer through Laser Heating

Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses

Novel Ag/Si composite particles through galvanic displacement and its conductive application

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