Development and Evaluation of a Planar Heat Pipe for Cooling Electronic Systems

Adami, M.; Yimer, B.

doi:10.1080/00986449008940577

Cited by 11 publications

(5 citation statements)

References 5 publications

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“…In 1990, Adami and Yimer [10] constructed a 15.24 cm × 30.48 cm × 1.905 cm FHP with water as the working fluid and three layers of #100 copper mesh as the wicking material. They found that gravitational orientation did not have a significant effect on the performance, and the axial temperature gradient increased nearly linearly with input power.…”

Section: The Development Of Polymer-based Flat Heat Pipes I Introducmentioning

confidence: 99%

The Development of Polymer-Based Flat Heat Pipes

Oshman

Shi

et al. 2011

J. Microelectromech. Syst.

101

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In this paper, polymer-based flat heat pipes (PFHPs) with a thickness on the order of 1 mm have been successfully developed and tested. Liquid-crystal polymer (LCP) films with copper-filled thermal vias are employed as the case material. A copper micropillar/woven mesh hybrid wicking structure was designed and fabricated to promote evaporation/condensation heat transfer and the liquid supply to the evaporator of the PFHP. Water was selected as the working fluid because of its superior thermophysical properties. An experimental study was conducted to examine the PFHP performance. The test data demonstrated that the PFHP can operate with a heat flux of 11.94 W/cm 2 and results in effective thermal conductivity ranging from 650 to 830 W/m · K, with the value varying with the input heat flux and the tilt angle. With the employment of flexible LCP as casing material, the PFHP could potentially be directly integrated into a printed circuit board or flexible circuits for thermal management of heat-generating components.[ 2010-0280]Index Terms-Cooling, flat heat pipe (FHP), hybrid wick, polymer.

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Section: The Development Of Polymer-based Flat Heat Pipes I Introducmentioning

confidence: 99%

The Development of Polymer-Based Flat Heat Pipes

Oshman

Shi

et al. 2011

J. Microelectromech. Syst.

101

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“…Test device mainly comprises: (1) vacuum phase change heat transfer working fluid filling system; (2) wind tunnel testing system [1,2]; (3) the electric heating simulation system; (4) measurement system (see Fig. 244.2).…”

Section: Test System Of New Radiatormentioning

confidence: 99%

“…A new radiator heat transfer and flow performance test system based on central processing unit (CPU) chip radiating is established in this paper [1][2][3][4]. The system can be a steady and transient heat transfer test.…”

Section: Introductionmentioning

confidence: 99%

Experiment of New Radiator in Electronic Device

2012

Electrical, Information Engineering and Mechatronics 2011

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The experimental apparatus is set up to test the heat transfer performance of the new radiator, which mainly includes vacuum-pumping and central processing unit (CPU) tunnel system, heating system and measurement system. The heat dissipation of the CPU chip is imitated by the copper bar which is heated by thermal resistance wire. The experimental results show that the temperature of the CPU chip decrease with growing of cooling air velocity, but the temperature drop tendency becomes gentle when it continues to increase. Higher heat dissipation power results in higher CPU chip temperature, but oversized heat flux density makes the phase changing process worse.

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“…They found out the boiling process time of glycerin oil preheated by CLOHP/CV heat exchanger was less than liquefied petroleum gas boiling process (Donmuang et al 2008). This feature makes the use of heat pipes desirable by many researchers: (Zhao et al 2016, Tiari et al 2015, Tiari et al 2016, Mahdavi et al 2018 and electronic cooling by many researchers: (Hassan and Harmand 2013, Adami and Yimer 1990, Peterson 1988, Mozumder et al 2011. Heat pipes which use nanofluids as working fluid are one of the most preferred heat transfer ways because of their rapid effectiveness (Aydin et al 2020: Hoseinzadeh et al 2017.…”

Section: Introductionmentioning

confidence: 99%

Correlation for Predicting Heat Transfer Characteristics of A Helical Oscillating Heat Pipe (HOHP) at Normal Operating Conditions

Donmuang

Chompookham

2020

Int. J. Renew. Energy Dev.

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The helical oscillating heat pipe (HOHP) is a high heat transfer heat exchanger with high flexibility in its installation and can therefore be used in a wide variety of applications. In this study, the effect of various parameters on the heat transfer rates of HOHP were used to establish a correlation equation for use in the heat flux prediction, the dimensionless parameters studied were rv/rl, Bo, Nu, We, Ja, Pr, Fr, Co, Ga, Bi, Wo, Oh, and Ku. Experiments were conducted to find out their effects on the heat transfer rates of copper HOHP with internal diameters were 2.03, 3.5, and 4.5 mm. The lengths of evaporator and condenser sections were equal at 1500, 2000, and 2500 mm. The pitch coils were 10, 15, and 20 mm. The working fluids used were R134a, ethanol, and water with the filling ratios were 30%, 50%, and 80% of the total internal volume. The temperature of evaporator section were varied between 60, 70, and 80°C within normal operating conditions in a vertical position. The results of the experiment showed that the internal diameter, lengths of evaporator/condenser sections, pitch coil, type of working fluid, filling ratio and temperature of evaporator section affected the heat transfer rates of the HOHP. The results of dimensionless parameters can establish the correlation equation to predict the heat flux for the HOHP as shown in this paper. In addition, the results of this research can be applied in the designing and construction of HOHP heat exchangers.

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Development and Evaluation of a Planar Heat Pipe for Cooling Electronic Systems

Cited by 11 publications

References 5 publications

The Development of Polymer-Based Flat Heat Pipes

The Development of Polymer-Based Flat Heat Pipes

Experiment of New Radiator in Electronic Device

Correlation for Predicting Heat Transfer Characteristics of A Helical Oscillating Heat Pipe (HOHP) at Normal Operating Conditions

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