Development and testing of a planar, silicon mini-capillary pumped loop

Yerkes, Kirk L.; Pettigrew, Kenneth; Smith, Brian J.; Gamlen, Carol; Liepmann, Dorian

doi:10.1063/1.1449711

Cited by 6 publications

(2 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These devices do not require external power for operation and have the working fluid hermetically sealed inside them. Because the conventional version of these devices [15][16][17] are bulky and ill-suited for modern compact electronic packages and other potential thermal management applications, smaller and thinner microfluidic versions have recently been proposed [4,6,[18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Enabling two-phase microfluidic thermal transport systems using a novel thermal-flux degassing and fluid charging approach

Dhillon

Pisano

2014

J. Micromech. Microeng.

View full text Add to dashboard Cite

A novel two-port thermal-flux method has been proposed and demonstrated for degassing and charging two-phase microfluidic thermal transport systems with a degassed working fluid. In microscale heat pipes and loop heat pipes (mLHPs), small device volumes and large capillary forces associated with smaller feature sizes render conventional vacuum pump-based degassing methods quite impractical. Instead, we employ a thermally generated pressure differential to purge non-condensable gases from these devices before charging them with a degassed working fluid in a two-step process. Based on the results of preliminary experiments studying the effectiveness and reliability of three different high temperature-compatible device packaging approaches, an optimized compression packaging technique was developed to degas and charge a mLHP device using the thermal-flux method. An induction heating-based noninvasive hermetic sealing approach for permanently sealing the degassed and charged mLHP devices has also been proposed. To demonstrate the efficacy of this approach, induction heating experiments were performed to noninvasively seal 1 mm square silicon fill-hole samples with donut-shaped solder preforms. The results show that the minimum hole sealing induction heating time is heat flux limited and can be estimated using a lumped capacitance thermal model. However, further continued heating of the solder uncovers the hole due to surface tension-induced contact line dynamics of the molten solder. It was found that an optimum mass of the solder preform is required to ensure a wide enough induction-heating time window for successful sealing of a fill-hole.

show abstract

Section: Introductionmentioning

confidence: 99%

Enabling two-phase microfluidic thermal transport systems using a novel thermal-flux degassing and fluid charging approach

Dhillon

Pisano

2014

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…The human brain has been put forth [2] as an example of a processor with a tightly integrated, adaptive cooling system where the cooling system (blood capillaries) is integrated side by side with the circuitry (neurons). In line with this vision, microscale loop heat pipes (mLHP) fabricated completely on silicon substrates have been proposed [5,[11][12][13][14][15] in order to integrate high-heat-flux cooling solutions directly into electronic substrates. This not only promises to limit the size of an overall electronic package by eliminating bulky cooling components but also provides for the localized cooling of thermal hot-spots.…”

Section: Introductionmentioning

confidence: 99%

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

Dhillon

Cheng

Pisano

2011

Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts a and B

View full text Add to dashboard Cite

Theoretical and numerical thermodynamic analysis of the evaporator section of a planar microscale loop heat pipe is presented, to minimize the permissible wick thickness in such a device. In conventional cylindrical loop heat pipes, a minimum wick thickness is required in order to reduce parasitic heat flow, and prevent vapor leakage, into the compensation chamber. By taking advantage of the possibilities allowed by microfabrication techniques, a planar evaporator/compensation chamber design topology is proposed to overcome this limitation, which will enable wafer-based loop heat pipes with device thicknesses on the order of a millimeter or less. Thermodynamic principles governing two-phase flow of the working fluid in a loop heat pipe are analyzed to elucidate the fundamental requirements that would characterize the startup and steady state operation of a planar phase-change device. A three dimensional finite element thermal-fluid solver is implemented to study the thermal characteristics of the evaporator section and compensation chamber regions of a planar vertically wicking micro-columnated loop heat pipe. The use of in-plane thermal conduction barriers to reduce parasitic heat flow into the compensation chamber is demonstrated.

show abstract

Design and demonstration of an ultra-thin planar microscale capillary pumped loop for electronics thermal management

Dhillon

2024

Applied Thermal Engineering

View full text Add to dashboard Cite

Development and testing of a planar, silicon mini-capillary pumped loop

Cited by 6 publications

References 0 publications

Enabling two-phase microfluidic thermal transport systems using a novel thermal-flux degassing and fluid charging approach

Enabling two-phase microfluidic thermal transport systems using a novel thermal-flux degassing and fluid charging approach

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

Design and demonstration of an ultra-thin planar microscale capillary pumped loop for electronics thermal management

Contact Info

Product

Resources

About