Development and validation of a lead-free alloy for solder paste applications

Laine-Ylijoki, T.; Steen, H.; Forsten, A.

doi:10.1109/3476.649440

Cited by 22 publications

(5 citation statements)

References 2 publications

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“…15 Four phases are in equilibrium: ␤-Sn rich solid solution, Cu 6 Sn 5 , Ag 3 Sn, and a liquid phase. 15 Four phases are in equilibrium: ␤-Sn rich solid solution, Cu 6 Sn 5 , Ag 3 Sn, and a liquid phase.…”

Section: A Microstructural Evolution Of Snagcu Samplesmentioning

confidence: 99%

Microstructural evolution and mechanical properties of SnAgCu alloys

Fouassier

Heintz

Chazelas

et al. 2006

Journal of Applied Physics

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Lead containing solder paste is now considered as an environmental threat. In order to eliminate this undesirable environmental impact associated to their production, a family of lead-free solder joint, Sn-3.8Ag-0.7Cu, is proposed. Microstructural and mechanical data of this solder joint have been acquired and compared with the most common used SnPb solder paste. The evolution of the microstructure as well as the failure mode and the mechanical properties of SnAgCu solder joint are discussed as a function of strain rate, annealing treatments, and testing temperature. Tensile tests have been performed, at temperatures ranging from −50 to + 150°C, on bulk samples. Changes of the mechanical properties of bulk tested samples are actually correlated with microstructural changes, as shown by transmission electronic microscopy investigations.

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Section: A Microstructural Evolution Of Snagcu Samplesmentioning

confidence: 99%

Microstructural evolution and mechanical properties of SnAgCu alloys

Fouassier

Heintz

Chazelas

et al. 2006

Journal of Applied Physics

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“…Previous work (Vincent and Humpston, 1994;Laine-Ylijoki et al, 1997;Warwick, 1999;Jacobson and Harrison, 1997) has shown that the SnAgCu solder forms sound joints on substrates used in electronics assembly, with reliability at least comparable with the conventional Sn63Pb37 solder. However, to study joint interfaces, several commonly used components were soldered using the current process, cross-sectioned and their interfacial structures studied.…”

Section: Joint Interface Considerationsmentioning

confidence: 99%

Development and validation of lead‐free wave soldering process

Forsten¹,

Steen

Wilding

et al. 2000

Soldering &Amp; Surface Mount Technology

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Though lead‐free replacements for SnPb eutectic alloys for reflow, wave, and hand soldering have been developed, relatively little has been reported on practical experience of lead‐free wave soldering processes. In wave soldering, the interaction between the PCB, flux, solder alloy and processing equipment makes it desirable to develop the consumables and the wave soldering machine concurrently. A crossfunctional project team was formed and a lead‐free wave soldering process developed and validated through nine months of industrial use in production of broad‐band communications technology products.

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“…[3][4][5][6][7][8] Among them, eutectic SnAg alloy is an attractive one with a melting temperature (~221∞C) 9 higher than that of eutectic SnPb solder, being acceptable for high temperature applications. [3][4][5][6][7][8] Among them, eutectic SnAg alloy is an attractive one with a melting temperature (~221∞C) 9 higher than that of eutectic SnPb solder, being acceptable for high temperature applications.…”

Section: Introductionmentioning

confidence: 99%