Development of 30 micron Pitch Bump Interconnections for COC-FCBGA

Abstract

We developed the flip-chip bonding technology on ChipOn-Chip (COC) package with ultra-fine pitch bump, which leads advanced high performance devices. On this package, the realization of the metallographic behavior in the microbump interconnection is the substantial issue for achieving good bondability and reliability. In this paper, to implement Flip-Chip BGA package with COC structure (COC-FCBGA), the metal systems of micro-bump and the dimension especially metal plating thickness have been optimized by precise analysis. And it is confirmed that the specification we fixed on this package would meet sufficient quality level for fine pitch bonding. This COC-FCBGA technology will meet demands for high-end system solutions in very near future.

Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure

“…Recently, ultra-fine pitch flip-chip bump interconnection technology with bump of 10~30 µm in diameter is under investigation for emerging new packaging technologies such as Chip-on-Chip (COC) package [1], Silicon-carrier System-on-Package (SOP) [2] and Si interposer with Through Silicon Via (TSV) [3][4].…”