Development of a 36 GHz millimeter-wave BGA package

Liang, Hongwei; Laskar, J.; Hyslop, M.; Panicker, Ram

doi:10.1109/mwsym.2000.860886

2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)

DOI: 10.1109/mwsym.2000.860886

|View full text |Cite

Development of a 36 GHz millimeter-wave BGA package

Hongwei Liang

J. Laskar²,

M. Hyslop³

et al.

Abstract: We present a 36GHz ball grid array (BGA) package design and its experimental characterization. A novel wide band de-embedding technique has been developed for accurate characterization of the package. A hybrid model has been developed for the transition including the ball and via interconnection and is verified with the measurement data of a microstrip line test structure. The transition demonstrates an insertionloss better than 0.3dB to 36GHz. The performance is demonstrated by measuring a MMIC amplifier buil… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Publication Types

Select...

Other5

Relationship

Self Cite0

Independent5

Authors

Journals

Cited by 15 publications

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

RF/Wireless Packaging

Pinel,

Tentzeris,

Staicnlescu

et al. 2005

Encyclopedia of RF and Microwave Engineering

View full text Add to dashboard Cite

The electronics packaging industry has proliferated to a point where its technology is at least equally—the semiconductor technology it is designed to serve. The increase in silicon complexity and integration has imposed demanding requirements on packaging technology for higher I/O counts, finer lead pitch, enhanced heat dissipation, and high‐speed, reliable interconnects. At the same time, the industry is also driving toward reduced printed‐circuit‐board area and complexity. From the traditional role of a protective mechanical enclosure, the modern package has been transformed into a sophisticated thermal and electrical management platform. Recent advances in high‐frequency packaging indicate a migration from wirebond (where the chip or die is interconnected to the package only on the periphery of the die) to flip‐chip (where the die is interconnected to the package using the entire die area); and from ceramic to organic packages, with cartridge and multichip technologies emerging as key form factors. The RF front‐end module is the core of the complex systems, and its integration poses a great challenge. Considering the characteristics of the RF modules, such as high performance up to 100 GHz; a large number of high‐performance discrete passive components, design flexibility, reconfigurable architecture, low power consumption, compactness, customized product, short time to market, and low cost, the system‐on package (SoP ) approach has emerged as the most effective means to provide a realistic integration solution as opposed to the system‐on‐chip (SoC ) solution. The strength of SoP is based on multilayer technololgy using low‐cost and high‐performance materials.

show abstract

RF/Wireless Packaging

Pinel,

Tentzeris,

Staicnlescu

et al. 2005

Encyclopedia of RF and Microwave Engineering

View full text Add to dashboard Cite

show abstract

Multi-channel module design for mobile satellite communications

Jung

2012

2012 18th Asia-Pacific Conference on Communications (APCC)

View full text Add to dashboard Cite

Development of Multi-Layer Liquid Crystal Polymer Ka-band Receiver Modules

Aihara¹,

Pham²,

Zeeb³

et al. 2007

2007 Asia-Pacific Microwave Conference

View full text Add to dashboard Cite

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Development of a 36 GHz millimeter-wave BGA package

Cited by 15 publications

References 6 publications

RF/Wireless Packaging

RF/Wireless Packaging

Multi-channel module design for mobile satellite communications

Development of Multi-Layer Liquid Crystal Polymer Ka-band Receiver Modules

Contact Info

Product

Resources

About