No abstract

No abstract

We present a 36GHz ball grid array (BGA) package design and its experimental characterization. A novel wide band de-embedding technique has been developed for accurate characterization of the package. A hybrid model has been developed for the transition including the ball and via interconnection and is verified with the measurement data of a microstrip line test structure. The transition demonstrates an insertionloss better than 0.3dB to 36GHz. The performance is demonstrated by measuring a MMIC amplifier built on the package. Our results show that the BGA is a cost-effective solution for millimeter wave RFIC packaging.

No abstract